Abstract: Provided are blends of linear low density polyethylene copolymers with very low density, low density, medium density, high density, and differentiated polyethylenes and other polymers. The invention also includes articles produced from the linear low density polyethylene and polyethylene blends described herein.

Abstract: Polyethylene blend compositions suitable for injection molding, injection molded articles, and processes for injection molding articles are provided. The polyethylene compositions include a first polyethylene having a melt index of 0.1 to 3.0 g/10 min and a density of from 0.905 to 0.938 g/cm3; and a second polyethylene having a melt index of 10 to 500 g/10 min and a density of 0.945 to 0.975 g/cm3. The compositions have a density of from 0.920 to 0.973 g/cm3 and a melt index of 2 to 200 g/10 min, and the density of the second polyethylene is from 0.037 to 0.062 g/cm3 greater than the density of the first polyethylene. The compositions exhibit improved physical properties, such as Environmental Stress Crack Resistance, relative to conventional compositions of similar melt index and density. In certain embodiments, the compositions, and articles produced therefrom, also exhibit an improved balance of toughness properties and processability properties.

Abstract: Provided are blends of linear low density polyethylene copolymers with very low density, low density, medium density, high density, and differentiated polyethylenes and other polymers. The invention also includes articles produced from the linear low density polyethylene and polyethylene blends described herein.

Abstract: Disclosed are hot melt adhesives comprising tackifier and a high M.sub.w, narrow MWD, narrow CD ethylene/alpha-olefin copolymer(s) and a low M.sub.w, narrow MWD, narrow MWD ethylene/alpha-olefin copolymer prepared with either supported or unsupported cyclopentadienyl derivatives of Group IV and catalysts for applications in hot melt adhesives, particularly in automotive product assembly, packaging and food packaging. These ethylene copolymers have a M.sub.w ranging from about 20,000 to about 100,000, an MWD of less than 6 and 3 to 17 mole percent comonomer, and composition distribution breadth index above 70 percent. These ethylene copolymer blends have a M.sub.w ranging from about 20,000 to about 100,000 and an MWD of less than 6. In addition, the copolymer blends have comonomer mole percent ranging from about 3 to about 17.

Abstract: Heat sealed articles and heat sealable films comprising a polymer blend of a first polymer having a narrow molecular weight and composition distribution and a second polymer having a broad molecular weight distribution and composition distribution. The articles and films have significantly improved physical characteristics and remarkably low heat seal initiation temperatures, high seal strength, high hot tack and therefore provide improved processibility and higher line speeds on commercial heat sealing equipment.