Patents by Inventor Barry Craig Snyder

Barry Craig Snyder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple redundant through hole electrical interconnects and method for forming the same
    Patent number: 6659592
    Abstract: An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: December 9, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hubert Allen Vander Plas, Barry Craig Snyder, Ron Allen Hellekson, Alfred I-Tsung Pan
  • Multiple redundant through hole electrical interconnects and method for forming the same
    Publication number: 20030035027
    Abstract: An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
    Type: Application
    Filed: August 16, 2001
    Publication date: February 20, 2003
    Inventors: Hubert Allen Vander Plas, Barry Craig Snyder, Ron Allen Hellekson, Alfred I-Tsung Pan