Abstract: An optical device for coupling an optical signal to an optical detector is disclosed. The optical device includes a mode compression section disposed between an optical input source and a photodetector, which enables efficient coupling between the optical input source and the photodetector.

Abstract: This invention is predicated upon applicants'discovery that the quality of high performance heterointerface devices having diffused junction depends significantly on the rate of cooling after diffusing the junctions. Use of the method to fabricate a high performance photodiode is described.

Abstract: A process for device fabrication is disclosed in which two substrates having different crystal lattices are bound together. In the process the substrate surfaces are placed in physical contact with each other. A flexible membrane is placed in physical contact with a surface of one of the substrates. Pneumatic force is applied to the flexible membrane. The duration of the contact and the pressure of the contact are selected to facilitate a bond between the two substrate surfaces that results from attractive Van der Waals' forces between the two surfaces. The bulk of one of the substrates is then typically removed. Thereafter, the bonded surfaces are heated to a high temperature to effect a permanent bond.

Abstract: A process for device fabrication is disclosed in which two substrates having different crystal lattices are bound together. In the process the substrate surfaces are thoroughly cleaned and placed in physical contact with each other. The duration of the contact and the pressure of the contact are selected to facilitate a bond between the two substrate surfaces that results from attractive Van der Waals' forces between the two surfaces. The bonded substrates are heated to a moderate temperature to effect escape of gases which may be entrapped by the substrates. The bulk of one of the substrates is then typically removed. The substrates can be heated again to a moderate temperature to effect removal of any gases remaining entrapped on the substrates. Thereafter, the bonded surfaces are heated to a high temperature to effect a permanent bond.

Abstract: Apparatus for processing a silicon workpiece uses reflected UV light to measure and control the workpiece temperature. A linearly polarized beam including UV light is directed onto a silicon surface to produce a reflected beam. The reflected beam is cross-polarized to null out much of the light, and the resulting residual reflectivity spectrum is determined. The temperature is determined from the characteristics of this spectrum. A workpiece heating station uses this measuring technique to accurately control the temperature of a silicon workpiece and temperature-dependent processing over a wide range of processing temperatures, including temperatures below 500.degree. C.

Abstract: A process for device fabrication is disclosed in which two substrates having different crystal lattices are bound together. In the process a layer of material that has a crystal lattice similar to the crystal lattices of the first substrate is formed on the surface of the second substrate. The thickness of the layer is about 1 nm to about 2 nm. The layer of material is then bound to the surface of the first substrate.

Abstract: An optically nonlinear liquid thin film in a thin film optical waveguide is utilized in order to produce optical parametric interactions such as second harmonic generation. Optimization (tuning) of parametric output by "phase matching" is achieved by means of an electric field which is set up in the liquid film, the field having a spatial periodicity along the propagation direction of the optical waves in the thin film. Alternative or further optimization of parametric output is achieved by varying the thickness of the liquid film in situ.