Abstract: An RFID interposer has conductive material that includes an impedance matching structure. The impedance matching structure aids in matching impedance between a chip that is to be mounted to the interposer, and an antenna that the interposer is to be coupled to. The impedance matching structures may allow different chips, with slightly different electrical characteristics, to be impedance matched to the same antenna configuration, using the same type of interposer. The impedance matching structure may have any of a variety of configurations in the electrically conductive material of the interposer. The structure may be parts of the chip mounting bond pads, may be part of the conductive electrical connection between the chip bond pads and antenna bond pads, may be part of connections between the chip bond pads and the antenna bond pads, and/or may be only indirectly electrically coupled to the antenna bond pads (such as by capacitive coupling).

Abstract: An RFID interposer has conductive material that includes an impedance matching structure. The impedance matching structure aids in matching impedance between a chip that is to be mounted to the interposer, and an antenna that the interposer is to be coupled to. The impedance matching structures may allow different chips, with slightly different electrical characteristics, to be impedance matched to the same antenna configuration, using the same type of interposer. The impedance matching structure may have any of a variety of configurations in the electrically conductive material of the interposer. The structure may be parts of the chip mounting bond pads, may be part of the conductive electrical connection between the chip bond pads and antenna bond pads, may be part of connections between the chip bond pads and the antenna bond pads, and/or may be only indirectly electrically coupled to the antenna bond pads (such as by capacitive coupling).

Abstract: A radio frequency identification device (RFID) antenna structure includes electrically-conductive material. The antenna structure includes low effective resistance-material areas and high effective resistance areas in regions where there would be little current flow if there were more low effective resistance material. The high effective resistance areas may be spaces within the antenna structure in which there is substantially no electrically conductive material. Alternatively, high effective resistance material in the high effective resistance areas may have a non-zero lower electrical conductivity than the low effective resistance material in the low effective resistance-material areas. Conductive material for the antenna structure may include conductive ink. By reducing or eliminating the amount of conductive material in the high effective resistance areas, it will be appreciated that reduced-cost devices may be obtained.