Patents by Inventor Barry Kent Witherspoon

Barry Kent Witherspoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroforming a slip ring
    Patent number: 6502298
    Abstract: Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: January 7, 2003
    Assignee: Litton Systems, Inc.
    Inventors: Barry Kent Witherspoon, Larry Dean Vaught
  • Electrical slip ring having a higher circuit density
    Patent number: 6356002
    Abstract: Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.
    Type: Grant
    Filed: February 8, 1999
    Date of Patent: March 12, 2002
    Assignee: Northrop Grumman Corporation
    Inventors: Barry Kent Witherspoon, Larry Dean Vaught