Patents by Inventor Barry M. Starr

Barry M. Starr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit
    Patent number: 10418406
    Abstract: Aspects and examples described herein provide a hybrid imaging sensor chip assembly for reducing undesired radiative transfer between a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC) and an optical detector, and methods of manufacturing a hybrid imaging sensor chip assembly. In one example, a hybrid imaging sensor chip assembly includes an optical detector configured to collect electromagnetic radiation incident thereon, a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC), and a radiation-shielding wafer interposed between the optical detector and the CMOS ROIC, the radiation-shielding wafer including a plurality of through wafer vias (TWVs) electrically coupled to the optical detector and the CMOS ROIC, the radiation-shielding wafer being positioned to prevent radiative transfer between the CMOS ROIC and the optical detector.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 17, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Sean P. Kilcoyne, John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears, John J. Drab
  • HYBRID SENSOR CHIP ASSEMBLY AND METHOD FOR REDUCING RADIATIVE TRANSFER BETWEEN A DETECTOR AND READ-OUT INTEGRATED CIRCUIT
    Publication number: 20180190705
    Abstract: Aspects and examples described herein provide a hybrid imaging sensor chip assembly for reducing undesired radiative transfer between a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC) and an optical detector, and methods of manufacturing a hybrid imaging sensor chip assembly. In one example, a hybrid imaging sensor chip assembly includes an optical detector configured to collect electromagnetic radiation incident thereon, a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC), and a radiation-shielding wafer interposed between the optical detector and the CMOS ROIC, the radiation-shielding wafer including a plurality of through wafer vias (TWVs) electrically coupled to the optical detector and the CMOS ROIC, the radiation-shielding wafer being positioned to prevent radiative transfer between the CMOS ROIC and the optical detector.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 5, 2018
    Inventors: Sean P. Kilcoyne, John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears, John J. Drab