Abstract: A laminated transaction card may comprise a core layer comprising post-consumer polyethylene, a first support layer comprising polyethylene terephthalate glycol coupled to a first surface of the core layer by a first adhesive layer, and a second support layer comprising polyethylene terephthalate glycol coupled to a second surface of the core layer by a second adhesive layer. The first adhesive layer and the second adhesive layer may comprise an adhesive formulated to bond the post-consumer polyethylene and the support layers.

Abstract: Methods and systems for product authentication include the storage of product authenticity data in integrated circuit (IC) chips of verification objects for physical association with authentic products. The IC chips are operable to determine verification data using the stored product authenticity data, and may include private key encryption, private algorithm and/or count processing functionality for verification data determination. A verification server(s) is utilized to receive an inbound message(s) from an electronic device(s) that includes test data obtained by the electronic device(s) from an integrated circuit chip at a product of interest, and in response thereto, to send an outbound message to the electronic device(s) indicative of verification or non-verification of authenticity of the product of interest, based upon identification or non-identification of an association between the test data and product authenticity data.

Abstract: A laminated transaction card may comprise post-consumer polyethylene with a thickness of at least 30% of a thickness of the laminated transaction card. A first polymer- based layer comprising polyvinyl chloride is coupled to a first surface of the core layer by a first adhesive layer. A second polymer-based layer comprising polyvinyl chloride is coupled to a second surface of the core layer by a second adhesive layer. The first adhesive layer and the second adhesive layer comprise an adhesive formulated to bond the post-consumer polyethylene and the polymer-based layers.

Abstract: An inlay for a transaction card includes a weighted member and a surround positioned around a perimeter of the weighted member. A first film is positioned on a first surface of the weighted member and a first surface of the surround and a second film is positioned on a second surface of the weighted member and a second surface of the surround.

Abstract: A system for encoding IC chip modules for inclusion in payment objects is provided. The system includes a flexible substrate supportably interconnected to a plurality of IC chip modules an one or more interfaces for encoding data on the plurality of IC chip modules, wherein the data encoded by the one or more interfaces includes data associated with an issuer payment institution. A positioner is configured to engage with the flexible substrate to position the plurality of IC chip modules relative to the one or more interfaces. At least one controller is configured to provide position control signals to the positioner for positioning the IC chip modules relative to the one or more interfaces and to provide encoding control signals to the one or more interfaces to encode the data on the plurality of IC chip modules.

Abstract: Edge-to-edge metal transaction cards and associated production methods are disclosed. The transaction cards include a metallic member and an interconnected first core layer that each extend from edge-to-edge about the length and width of the transaction card. In one approach, the metallic member may extend substantially continuously across the lateral extent of the card (e.g. except for a pocket that receives an IC chip and contact pads), and the first core layer may be transparent with printing on an inward-facing and/or out-ward-facing side. In another approach, the metallic member may be frame-like with an inlay and supportably interconnected inlay antenna disposed in an opening through the metallic member. A second core layer may be interconnected to a second side of the metallic member. A metal face may be provided on an outward-facing side of the first core layer and/or second core layer.

Abstract: A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

Abstract: An inlay for a transaction card includes a weighted member and a surround positioned around a perimeter of the weighted member. A first film is positioned on a first surface of the weighted member and a first surface of the surround and a second film is positioned on a second surface of the weighted member and a second surface of the surround.

Abstract: Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

Abstract: An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module may further include conductive protrusions supportably connected to the inward-facing surface and having protruding ends that extend in to a thickness of corresponding embedded conductive contacts of the card body.

Abstract: A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

Abstract: Methods and systems for product authentication include the storage of product authenticity data in integrated circuit (IC) chips of verification objects for physical association with authentic products. The IC chips are operable to determine verification data using the stored product authenticity data, and may include private key encryption, private algorithm and/or count processing functionality for verification data determination. A verification server(s) is utilized to receive an inbound message(s) from an electronic device(s) that includes test data obtained by the electronic device(s) from an integrated circuit chip at a product of interest, and in response thereto, to send an outbound message to the electronic device(s) indicative of verification or non-verification of authenticity of the product of interest, based upon identification or non-identification of an association between the test data and product authenticity data.

Abstract: Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

Abstract: A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

Abstract: Edge-to-edge metal transaction cards and associated production methods are disclosed. The transaction cards include a metallic member and an interconnected first core layer that each extend from edge-to-edge about the length and width of the transaction card. In one approach, the metallic member may extend substantially continuously across the lateral extent of the card (e.g. except for a pocket that receives an IC chip and contact pads), and the first core layer may be transparent with printing on an inward-facing and/or out-ward-facing side. In another approach, the metallic member may be frame-like with an inlay and supportably interconnected inlay antenna disposed in an opening through the metallic member. A second core layer may be interconnected to a second side of the metallic member. A metal face may be provided on an outward-facing side of the first core layer and/or second core layer.

Abstract: An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module may further include conductive protrusions supportably connected to the inward-facing surface and having protruding ends that extend in to a thickness of corresponding embedded conductive contacts of the card body.

Abstract: Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

Abstract: Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

Abstract: Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards.

Abstract: A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.