Patents by Inventor Barry Roy Bowman

Barry Roy Bowman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for preparing semiconductor wafers for measurement
    Patent number: 6861619
    Abstract: A wafer-cleaning module can remove contaminants from a semiconductor wafer prior to measurement in a metrology tool. A heating chamber and heater plate of the cleaning module can be used to heat the wafer by conduction, while a separate cooling chamber can be used to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: March 1, 2005
    Assignee: Therma-Wave, Inc.
    Inventors: Michial Duff Howell, Barry Roy Bowman
  • Method and apparatus for preparing semiconductor wafers for measurement
    Patent number: 6624393
    Abstract: A wafer-cleaning module is disclosed for removing contaminants from a semiconductor wafer prior to measurement in a metrology tool. The cleaning module includes a heating chamber including a heater plate for heating the wafer by conduction. A separate cooling chamber is provided to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: September 23, 2003
    Assignee: Therma-Wave, Inc.
    Inventors: Michial Duff Howell, Barry Roy Bowman
  • Method and apparatus for preparing semiconductor wafers for measurement
    Publication number: 20010020614
    Abstract: A wafer-cleaning module is disclosed for removing contaminants from a semiconductor wafer prior to measurement in a metrology tool. The cleaning module includes a heating chamber including a heater plate for heating the wafer by conduction. A separate cooling chamber is provided to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
    Type: Application
    Filed: May 17, 2001
    Publication date: September 13, 2001
    Inventors: Michial Duff Howell, Barry Roy Bowman
  • Method and apparatus for preparing semiconductor wafers for measurement
    Patent number: 6261853
    Abstract: A wafer-cleaning module is disclosed for removing contaminants from a semiconductor wafer prior to measurement in a metrology tool. The cleaning module includes a heating chamber including a heater plate for heating the wafer by conduction. A separate cooling chamber is provided to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: July 17, 2001
    Assignee: Therma-Wave, Inc.
    Inventors: Michial Duff Howell, Barry Roy Bowman