Abstract: Nozzle and a method of making the same are disclosed.

Abstract: Light assembly having reflector (17), a light source (22), an outer light cover (12) having a first color zone (15) and a second, different color or clear zone (16), and an inner lens (19) with a transflective surface. Embodiments of light assemblies described herein are useful, for example, as signs, backlights, displays, task lighting, luminaire, and vehicle (e.g., cars, trucks, airplanes, etc.) components. Vehicle comprising light assemblies include those where the light assembly is a vehicle tail light assembly.

Abstract: Light assembly (10) having reflector (16), light source(18), an outer light cover(12), and a curved transflective surface (15). Embodiments of light assemblies described herein are useful, for example, as signs, backlights, displays, task lighting, luminaire, and vehicle (e.g., cars, trucks, airplanes, etc.) components. Vehicle comprising light assemblies include those where the light assembly is a vehicle tail light assembly.

Abstract: An optical device comprises a cantilevered fiber array coupled to a planar lightwave circuit. The cantilevered fiber array comprises a base supporting at least a portion of at least one optical fiber in a fiber guiding channel and a cover bonded to the base and/or the at least one optical fiber, where a terminal end of the at least one optical fiber extends beyond an end of at least one of the base and cover. The planar lightwave circuit comprises a planar waveguide formed on a substrate, the planar waveguide including a waveguide core. The terminal end of the fiber of the cantilevered fiber array is disposed in an alignment groove formed in a portion of the planar lightwave circuit substrate. A transverse channel is formed in the planar lightwave circuit substrate at an optical interface of the waveguide core and the terminal end of the at least one optical fiber.

Abstract: A tooling system for handling optical micro-mechanical devices. A tooling fixture is attached to the MEMS die, preferably before the optical micro-mechanical devices are released. The tooling fixture does not interfere with removal of the sacrificial material, facilitates handling of the MEMS die and ultimately becomes an integral part of the packaged optical micro-mechanical device. The tooling fixture can be a heat sink, a compliant thermally conductive material and/or a tooling post.

Abstract: A packaged optical micro-mechanical device. A die includes one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. A package frame includes an aperture and a package frame reference surface proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves are positioned relative to an optical interface reference plane adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.

Abstract: A package for optical micro-mechanical devices including a die with one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. One or more optical interconnect alignment mechanisms are formed in the first surface of the die. The optical interconnect alignment mechanisms are positioned to optically couple an optical interconnect with one or more of the optical micro-mechanical devices on the die. A package frame including an aperture and a package frame reference surface proximate the aperture is adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more optical interconnect alignment mechanisms are formed in the package frame.

Abstract: A package for optical micro-mechanical devices including a die with one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. One or more optical interconnect alignment mechanisms are formed in the first surface of the die. The optical interconnect alignment mechanisms are positioned to optically couple an optical interconnect with one or more of the optical micro-mechanical devices on the die. A package frame including an aperture and a package frame reference surface proximate the aperture is adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more optical interconnect alignment mechanisms are formed in the package frame.

Abstract: A tooling system for handling optical micro-mechanical devices. A tooling fixture is attached to the MEMS die, preferably before the optical micro-mechanical devices are released. The tooling fixture does not interfere with removal of the sacrificial material, facilitates handling of the MEMS die and ultimately becomes an integral part of the packaged optical micro-mechanical device. The tooling fixture can be a heat sink, a compliant thermally conductive material and/or a tooling post.

Abstract: A packaged optical micro-mechanical device. A die includes one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. A package frame includes an aperture and a package frame reference surface proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves are positioned relative to an optical interface reference plane adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.

Abstract: A stubless optoelectronic device receptacle for connecting multifiber optical ribbon cables to optoelectronic semiconductor components is provided. The optoelectronic device receptacle consists of a receptacle alignment block portion contained in the receptacle body. The alignment block has a connector coupling surface for engaging the fiber optic ribbon connector. An optoelectronic semiconductor component is fixedly mounted to the connector coupling surface of the alignment block and a flexible circuit is then mounted to the electronic semiconductor component to provide power to the component. In the preferred embodiment, the alignment block contains mechanical features which perform precision alignment of the block to a connector attached to the fiber ribbon cable.