Abstract: A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electrical connections, each electrical connection coupled for providing electrical power to a respective LESD. The LESDs are arranged on the substrate with sufficient density and light generating capability to provide a predetermined irradiation from the light source.

Abstract: A power semiconductor device package includes at least one power semiconductor device mounted onto at least one electrically and thermally conductive spacer having an upper end surface bonded to a back surface of the device; a substrate of hardened substrate molding material surrounding the semiconductor device and the spacer except for an active major surface of the device and an lower end surface of the spacer, a dielectric film overlying the device active major surface and a top side of the substrate, the dielectric layer having a plurality of holes aligned with predetermined ones of the contact pads; a top side patterned metal layer on the dielectric film including portions extending into the holes electrically and thermally connected to contact pads of the device; and a backside metal layer on a substrate bottom side electrically and thermally connected to the spacer lower end surface.

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole.

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole.

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole.