Patents by Inventor Barry T. Dale

Barry T. Dale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hinge assembly
    Patent number: 9354668
    Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: May 31, 2016
    Assignee: Intel Corporation
    Inventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, Jr., Stephen J. Allen, Patrick S. Johnson
  • Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
    Patent number: 9244487
    Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 26, 2016
    Assignee: Intel Corporation
    Inventors: Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale, Chia-Pin Chiu
  • HINGE ASSEMBLY
    Publication number: 20150227174
    Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.
    Type: Application
    Filed: July 30, 2013
    Publication date: August 13, 2015
    Inventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, JR., Stephen J. Allen, Patrick S. Johnson
  • INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES
    Publication number: 20140082915
    Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 27, 2014
    Inventors: Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale, Chia-Pin Chiu
  • Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
    Patent number: 8622764
    Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: January 7, 2014
    Assignee: Intel Corporation
    Inventors: Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale, Chia-Pin Chiu
  • INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES
    Publication number: 20120200993
    Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 9, 2012
    Inventors: Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale, Chia-Pin Chiu