Patents by Inventor Barry Vyse

Barry Vyse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packages
    Patent number: 4672418
    Abstract: An integrated circuit package including a lead frame (11) sealed between base and cap portions (1 and 3) of the package enclosure. Outwards of the seal each lead (13) in the frame (11) follows an angled path so that manipulation of leads outside the package is unlikely to damage the seal. The angling of the leads (13) is effected by appropriately shaping the cap and base parts (1 and 3) of the package.
    Type: Grant
    Filed: April 8, 1985
    Date of Patent: June 9, 1987
    Inventors: Peter Moran, Barry Vyse