Patents by Inventor Barry W. Bartos

Barry W. Bartos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6472601
    Abstract: An electrically-conductive, thermally-insulating structure includes a thermally-insulating layer having a thermal conductivity of no more than about 3.5×10−3 W/hr·cm·°K and an electrically-conductive layer, applied to the thermally-insulating layer, which has an electrical resistivity of no more than about five ohms at 700° C. The thermally-insulating layer can include a plurality of microballoons to decrease the density of the thermally-insulating layer.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: October 29, 2002
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Hunn, Barry W. Bartos
  • Publication number: 20020144836
    Abstract: An electrically-conductive, thermally-insulating structure includes a thermally-insulating layer having a thermal conductivity of no more than about 3.5×10−3 W/hr·cm·° K and an electrically-conductive layer, applied to the thermally-insulating layer, which has an electrical resistivity of no more than about five ohms at 700° C. The thermally-insulating layer can comprise a plurality of microballoons to decrease the density of the thermally-insulating layer.
    Type: Application
    Filed: January 15, 2002
    Publication date: October 10, 2002
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: David L. Hunn, Barry W. Bartos
  • Publication number: 20020129964
    Abstract: An electrically-conductive, thermally-insulating structure includes a thermally-insulating layer having a thermal conductivity of no more than about 3.5×10−3 W/hr·cm·°K. and an electrically-conductive layer, applied to the thermally-insulating layer, which has an electrical resistivity of no more than about five ohms at 700° C. The thermally-insulating layer can comprise a plurality of microballoons to decrease the density of the thermally-insulating layer.
    Type: Application
    Filed: January 30, 2001
    Publication date: September 19, 2002
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: David L. Hunn, Barry W. Bartos