Abstract: In one embodiment, an interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly. Each conductive contact pad has a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is also disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps.

Abstract: There is disclosed an interconnect assembly. In an embodiment, the interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly, having a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps. Other embodiments are also disclosed.

Abstract: There are disclosed interconnect assemblies. In an embodiment, an interconnect assembly may include a rigid printed circuit assembly having a substrate, conductive contact pads disposed on the substrate, the conductive contact pads configured for selective engagement with the conductive contact bumps, bumped flex circuit assemblies having support plates and conductive contact bumps; and a hard stop assembly extending between from the substrate, wherein the hard stop assembly restricts non-uniform motion of the substrate toward the first and second support plates. Methods of forming interconnects are provided. In an embodiment, a method may include positioning hard stop assemblies extending from first and second support plates in contact with a rigid printed circuit assembly; and positioning first and second pluralities of conductive contact bumps in electrical contact with first and second pluralities of conductive contact pads, respectively. Other embodiments are also disclosed.