Abstract: Methods and associated devices for programming a therapy for an implantable baroreflex activation system are described, including for programming the implantable baroreflex stimulation system with operating parameters.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: Embodiments of the present invention generally pertain to devices and methods for use in conjunction with implanting a baroreflex therapy system which includes an implantable pulse generator and associated circuitry contained within a hermetically sealed housing, an elongate flexible electrical lead connectable to the housing, and a monopolar electrode structure coupled with the electrical lead. More specifically, the devices and methods of the present invention allow for a mapping procedure to be conducted as part of the implant procedure prior to fully implanting the baroreflex therapy system.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In one application, the techniques of the present invention are used to connect circuit boards of an implantable medical device, such as a cardiac rhythm management device.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.

Abstract: A method of forming a surface mount transformer. The method comprises winding insulated wire around a magnetic core to form at least one secondary transformer coil, winding insulated wire around the magnetic core to form at least one primary transformer coil, attaching wire ends of the at least one primary coil to at least first and second vias of a printed circuit board (PCB), attaching wire ends of the at least one secondary coil to at least third and fourth vias of the PCB, affixing the coils and the magnetic core to the first side of the PCB, and attaching the coil wire ends flush to a surface of the vias on the second side of the PCB.