Patents by Inventor Bart KASSTEEN

Bart KASSTEEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE PACKAGE WITH SEALED DIE ENCLOSURES
    Publication number: 20240088081
    Abstract: Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventor: Bart KASSTEEN
  • High-power die heat sink with vertical heat path
    Patent number: 11929299
    Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: March 12, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jose Moreira, Markus Valtere, Bart Kassteen, Alberto Jose Teixeira De Queiros
  • HIGH-POWER DIE HEAT SINK WITH VERTICAL HEAT PATH
    Publication number: 20220359338
    Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 10, 2022
    Inventors: Jose MOREIRA, Markus VALTERE, Bart KASSTEEN, Alberto Jose TEIXEIRA DE QUEIROS