Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.

Abstract: A lamp having an enclosure with a reflector and a lens where the reflector is made of thermally conductive material. A base is coupled to the enclosure. An LED is located in the enclosure and emits light when energized through an electrical path from the base. A heat sink having a heat dissipating portion that may be at least partially exposed to the ambient environment and heat conducting portion that is thermally coupled to the LED. The reflector is thermally coupled to the heat sink and is exposed to the exterior of the lamp such that heat from the heat sink may be dissipated to the ambient environment at least partially through the reflector.

Abstract: A LED lamp comprises an enclosure containing a reflective surface and an optically transmissive exit surface and a base. A LED assembly is mounted on a submount, is located in the enclosure and is operable to emit light when energized through an electrical path from the base. The submount comprises a connector portion having a first electrical contact that is in the electrical path. A first spring contact is electrically coupled to lamp electronics where the lamp electronics and the first spring contact are in the electrical path. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED assembly. The connector portion is inserted into the heat sink such that the first electrical contact creates an electrical contact coupling with the first spring contact.

Abstract: A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly includes at least one LED, where the LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. An electronics board is in the electrical path where the electronics board is coupled to the base by an electrical interconnect comprising at least one base-side contact that is biased into engagement with the base.

Abstract: An LED lamp includes an elongated at least partially optically transmissive enclosure. The LEDs are mounted on an LED board. The enclosure has a support structure for supporting the LED board. The support structure is formed as one-piece with the enclosure and of an optical material. A pair of end caps are secured to the ends of the enclosure using a snap-fit connection. The end caps retain pins for connecting to a light fixture.

Abstract: A lamp has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion having a first part that is located inside of the enclosure and that is thermally coupled to the LED and a second part that is exposed to the ambient environment. The second part comprises a plurality of stems connected to the first part where each stem supports a first overhang that extends over a portion of the enclosure and a second overhang that extends over a portion of the base.

Abstract: An LED lamp includes an enclosure and a base. LEDs are mounted on a first portion of a substrate and an electrical contact is mounted on a second portion of the substrate. The LEDs emit light from the enclosure when energized through an electrical path from the base. A heat sink conducts heat to the ambient environment. The first portion of the substrate is mounted on an outside surface of a tower that extends into the enclosure. The second portion of the substrate is located inside of the tower. An extension is electrically coupled to the base and includes a second electrical contact that is electrically coupled to the first electrical contact.

Abstract: A lamp has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion having a first part that is located inside of the enclosure and that is thermally coupled to the LED and a second part that is exposed to the ambient environment. The second part comprises a plurality of stems connected to the first part where each stem supports a first overhang that extends over a portion of the enclosure and a second overhang that extends over a portion of the base.

Abstract: A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly comprising at least one LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED. The heat sink is connected to the base by a snap fit connector comprising a deformable first member on one of the base or heat sink engaging a second member on the other one of the heat sink and the base. A retention member holds the first member in engagement with the second member. A seal is positioned between the heat sink and the base, the seal being compressed between the heat sink and the base.

Abstract: A lamp has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion having a first part that is located inside of the enclosure and that is thermally coupled to the LED and a second part that is exposed to the ambient environment. The second part comprises a plurality of stems connected to the first part where each stem supports a first overhang that extends over a portion of the enclosure and a second overhang that extends over a portion of the base.

Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.

Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.

Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.