Abstract: A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly having a plurality of LEDs is located in the enclosure where the LEDs are operable to emit light when energized through an electrical path from the base. A heat sink has a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED assembly. The LED assembly is mounted on the heat conducting portion under radial tension. A retention member restrains the LED assembly from moving in an axial direction relative to the heat conducting portion.

Abstract: A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly having a plurality of LEDs is located in the enclosure where the LEDs are operable to emit light when energized through an electrical path from the base. A heat sink has a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED assembly. The LED assembly is mounted on the heat conducting portion under radial tension. A retention member restrains the LED assembly from moving in an axial direction relative to the heat conducting portion.

Abstract: Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing.

Abstract: Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing.

Abstract: Mobile devices with mechanically bonded connector assemblies and methods for forming such mobile devices are provided. A representative mobile device includes: a housing comprising a metal chassis; and a plastic connector assembly mechanically bonded to the metal of the chassis. A representative method includes: providing a metal chassis, the chassis defining an interior; and mechanically bonding a plastic connector assembly to the chassis, the connector being located within the interior.

Abstract: A shield for an electronic device having a pair of cooperating printed circuit boards includes an integrated connector for connecting the printed circuit boards. The shield is provided with a frame attachable between the circuit boards and structure attached to the frame for supporting a connector that electrically connects the circuit boards. In one embodiment, the contacts of the connector are embedded in a sub-frame attached to the frame. In another embodiment, a connector holder is formed with the frame for supporting a connector that connects the printed circuit boards. By virtue of the unitary structure, problems associated with tolerance stack-up can be eliminated, and usable printed circuit board area can be maximized.