Abstract: A method of processing a substrate that displays out-gassing when placed in a vacuum includes placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature T1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature T2 at which the diffusion rate of the substrate's contamination is lower than at T1. The substrate is further processed at the temperature T2 until the substrate has been covered with a film including a metal.

Abstract: A method of processing a substrate that displays out-gassing when placed in a vacuum comprises placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature T1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature T2 at which the diffusion rate of the substrate's contamination is lower than at T1. The substrate is further processed at said temperature T2 until the substrate has been covered with a film comprising a metal.

Abstract: A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ?, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ? of rotation of the magnet other than the first harmonic.

Abstract: A transport method for disk-shaped semiconductor wafer workpieces has a horizontally movable transport arm with two elongated carrying elements at one end, for receiving the workpiece. A cassette which includes a comb structure at each side for receiving several workpieces, is inserted free of contact between two adjacent combs with workpieces therein for vertically lifting a workpiece. The carrying elements are disposed such that during a cassette engagement they are each positioned substantially adjacent and parallel to the comb structure along a comb, and in this region along and between two adjacent comb planes on one side of the cassette, a scanning beam is provided for workpiece acquisition. The scanning beam is relatively height-positionable with respect to the cassette and is tilted about a small angle with respect to the horizontal workpiece plane.

Abstract: A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ?, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ? of rotation of the magnet other than the first harmonic.

Abstract: A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ?, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ? of rotation of the magnet other than the first harmonic.

Abstract: A method of processing a substrate that displays out-gassing when placed in a vacuum comprises placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature T1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature T2 at which the diffusion rate of the substrate's contamination is lower than at T1. The substrate is further processed at said temperature T2 until the substrate has been covered with a film comprising a metal.

Abstract: A transport method for disk-shaped semiconductor wafer workpieces has a horizontally movable transport arm with two elongated carrying elements at one end, for receiving the workpiece. A cassette which includes a comb structure at each side for receiving several workpieces, is inserted free of contact between two adjacent combs with workpieces therein for vertically lifting a workpiece. The carrying elements are disposed such that during a cassette engagement they are each positioned substantially adjacent and parallel to the comb structure along a comb, and in this region along and between two adjacent comb planes on one side of the cassette, a scanning beam is provided for workpiece acquisition. The scanning beam is relatively height-positionable with respect to the cassette and is tilted about a small angle with respect to the horizontal workpiece plane.

Abstract: The invention relates to a method for positioning a wafer (3) with a reference mark (6) in a vacuum processing unit with a transport chamber containing a transport device (2, 20, 21) for moving the wafers (3) in a plane to a process chamber arranged on said chamber and a single sensor (1), arranged within the transport chamber before the process chamber for recording the position of the wafer (3) by means of recording the edge thereof at a first detection point (4) and a second detection point (5), such that the actual position of the wafer (12) with a known wafer diameter can be determined with electronic analysis of both measured detection points (4, 5) and the transport device (2, 20, 21) guides the wafer (3) to a desired set position.

Abstract: A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ?, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ? of rotation of the magnet other than the first harmonic.

Abstract: The invention relates to a method for positioning a wafer (3) with a reference mark (6) in a vacuum processing unit with a transport chamber containing a transport device (2, 20, 21) for moving the wafers (3) in a plane to a process chamber arranged on said chamber and a single sensor (1), arranged within the transport chamber before the process chamber for recording the position of the wafer (3) by means of recording the edge thereof at a first detection point (4) and a second detection point (5), such that the actual position of the wafer (12) with a known wafer diameter can be determined with electronic analysis of both measured detection points (4, 5) and the transport device (2, 20, 21) guides the wafer (3) to a desired set position.

Abstract: A device for degassing a substrate plate in an evacuated environment with two substantially flat, parallel bodies spaced at a distance smaller than their longitudinal extent forming an interspace with the substrate located between the bodies and these projecting beyond the substrate at least in the margin region, wherein in at least one of the bodies a gas delivery is disposed for generating a laminar gas flow in the interspace along the bodies and the substrate in the radial direction toward the periphery of the bodies, and that here a pumping port is provided for pumping off the gas flow.

Abstract: A method and apparatus for removal of volatile contaminants from substrate surfaces before the substrate enters a process chamber. Substrate cleaning is achieved by irradiating the substrate with a low-energy electron beam. The interaction of the electrons in the beam with the contaminants present on the surface of the substrate causes evaporation of low vapor pressure species which can be deposited on the surface. A cryoshield pumps the evaporated species. After evaporation and pumping, the substrate passes through a glow discharge chamber wherein the negative surface charge created by the electron beam is neutralized using positive ions. The inventive apparatus can be configured so that no separate vacuum chamber is needed to prepare the substrate.

Abstract: A method and apparatus for removal of volatile contaminants from substrate surfaces before the substrate enters a process chamber. Substrate cleaning is achieved by irradiating the substrate with a low-energy electron beam. The interaction of the electrons in the beam with the contaminants present on the surface of the substrate causes evaporation of low vapor pressure species which can be deposited on the surface. A cryoshield pumps the evaporated species. After evaporation and pumping, the substrate passes through a glow discharge chamber wherein the negative surface charge created by the electron beam is neutralized using positive ions. The inventive apparatus can be configured so that no separate vacuum chamber is needed to prepare the substrate.

Abstract: A method and apparatus for removal of volatile contaminants from substrate surfaces before the substrate enters a process chamber. Substrate cleaning is achieved by irradiating the substrate with a low-energy electron beam. The interaction of the electrons in the beam with the contaminants present on the surface of the substrate causes evaporation of low vapor pressure species which can be deposited on the surface. A cryoshield pumps the evaporated species. After evaporation and pumping, the substrate passes through a glow discharge chamber wherein the negative surface charge created by the electron beam is neutralized using positive ions. The inventive apparatus can be configured so that no separate vacuum chamber is needed to prepare the substrate.

Abstract: A moving photoconverter device that converts an incident light image into an equivalent electron or other charged particle beam image. The moving photoconverter is ring shaped and is rotated by using a motor such that the incident light image exposes a moving photoconverter surface. The photoconverter may additionally or alternatively move in an X-Y motion or radially. Continuous regeneration is provided at a site remote from the region of moving photoconverter device that converts an incident light image into an equivalent electron or other charged particle beam image.

Abstract: A method and apparatus for removal of volatile contaminants from substrate surfaces before the substrate enters a process chamber. Substrate cleaning is achieved by irradiating the substrate with a low-energy electron beam. The interaction of the electrons in the beam with the contaminants present on the surface of the substrate causes evaporation of low vapor pressure species which can be deposited on the surface. A cryoshield pumps the evaporated species. After evaporation and pumping, the substrate passes through a glow discharge chamber wherein the negative surface charge created by the electron beam is neutralized using positive ions. The inventive apparatus can be configured so that no separate vacuum chamber is needed to prepare the substrate.

Abstract: A multipixel electron emission source is generated by separating a point electron source from a plasma region. The point electron source produces an electron beam that is passed through the plasma region. The plasma region diffuses the electron beam thereby producing electrons with uniform energy. Moreover, the maximum current of the device is advantageously controlled by the maximum electron current produced by the point electron source and not the characteristics of the plasma and wall interactions as found in conventional devices. The electrons are then pulled out of the plasma region by an aperture grid that is also used as a blanking array. A focusing chamber is positioned down stream of the plasma region and aperture grid. The aperture grid includes a base electrode and a blanker electrode, which is isolated from the base electrode. The base electrode is held at a potential.