Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing virtual device observation and debug network for high speed serial IOS.

Abstract: In one embodiment, a request may be received to load firmware on a microcontroller of a device. A firmware transfer may be initiated to load the firmware on the microcontroller. Data traffic may be monitored at one or more locations on a communication path associated with the firmware transfer. It may be determined whether the data traffic matches a digital fingerprint associated with the firmware.

Abstract: Embodiments are generally directed to phase lock loop bypass for board level testing of systems. An embodiment of system includes a power management block for the system; multiple IO (input/output) blocks; a phase lock loop (PLL) block for each of the IO blocks, each of the phase lock loop blocks being switchable between providing an output of a PLL clock signal or providing a replacement clock signal as clocking for the respective IO block; and a read only memory for storage of firmware. In some embodiments, the firmware includes elements to enable operation of the plurality of IO blocks utilizing replacement clocking.

Abstract: Embodiments are generally directed to phase lock loop bypass for board level testing of systems. An embodiment of system includes a power management block for the system; multiple IO (input/output) blocks; a phase lock loop (PLL) block for each of the IO blocks, each of the phase lock loop blocks being switchable between providing an output of a PLL clock signal or providing a replacement clock signal as clocking for the respective IO block; and a read only memory for storage of firmware. In some embodiments, the firmware includes elements to enable operation of the plurality of IO blocks utilizing replacement clocking.

Abstract: In one embodiment, a request may be received to load firmware from an external component to a microcontroller of a device. The external component may be authenticated, and the firmware may be loaded from the external component to the microcontroller using a firmware loading controller of the device, wherein the firmware is loaded using direct memory access without accessing system memory associated with the device.

Abstract: In one embodiment, a request may be received to load firmware on a microcontroller of a device. A firmware transfer may be initiated to load the firmware on the microcontroller. Data traffic may be monitored at one or more locations on a communication path associated with the firmware transfer. It may be determined whether the data traffic matches a digital fingerprint associated with the firmware.

Abstract: Stacked semiconductor packages and methods for performing bare die testing on a functional silicon die in a stacked semiconductor package are described. In an example, a stacked semiconductor package includes a functional silicon die, a test controller having signature accumulation logic embedded therein, and a fabric to route transactions between the test controller and any of a plurality of near memory controllers of the functional silicon die.

Abstract: A stacked semiconductor package comprising a functional silicon die having embedded thereupon a Wide Input/Output 2 (WIO2) interface, and two or more memory dies forming a corresponding two or more memory layers of the stacked semiconductor package. A plurality of Through Silicon Vias (TSVs) are formed through the two or more memory dies, wherein each of the plurality of TSVs traverse through the two or more memory layers to the functional silicon die via the WIO2 interface of the functional silicon die. A test port interface receives test signals from an external tester and routes the test signals through a steering logic communicably interfaced with the two or more memory dies. The steering logic shifts data into and out of the two or more memory dies through the plurality of TSVs.

Abstract: Stacked semiconductor packages and methods for performing bare die testing on a functional silicon die in a stacked semiconductor package are described. In an example, a stacked semiconductor package includes a functional silicon die, a test controller having signature accumulation logic embedded therein, and a fabric to route transactions between the test controller and any of a plurality of near memory controllers of the functional silicon die.

Abstract: A stacked semiconductor package comprising a functional silicon die having embedded thereupon a Wide Input/Output 2 (WIO2) interface, and two or more memory dies forming a corresponding two or more memory layers of the stacked semiconductor package. A plurality of Through Silicon Vias (TSVs) are formed through the two or more memory dies, wherein each of the plurality of TSVs traverse through the two or more memory layers to the functional silicon die via the WIO2 interface of the functional silicon die. A test port interface receives test signals from an external tester and routes the test signals through a steering logic communicably interfaced with the two or more memory dies. The steering logic shifts data into and out of the two or more memory dies through the plurality of TSVs.

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing virtual device observation and debug network for high speed serial IOS.

Abstract: A testing unit is provided with a test data communication port adapted to output test data to a device being tested. The testing unit also has an expected test result data communication port adapted to output expected test result data to the device. The device being tested generates test result data in response to the test data, and compares the test result data with the expected test result data to generate test status data, such as a pass or fail indication.

Abstract: A testing unit is provided with a test data communication port adapted to output test data to a device being tested. The testing unit also has an expected test result data communication port adapted to output expected test result data to the device. The device being tested generates test result data in response to the test data, and compares the test result data with the expected test result data to generate test status data, such as a pass or fail indication.

Abstract: A testing unit is provided with a test data communication port adapted to output test data to a device being tested. The testing unit also has an expected test result data communication port adapted to output expected test result data to the device. The device being tested generates test result data in response to the test data, and compares the test result data with the expected test result data to generate test status data, such as a pass or fail indication.