Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Abstract: A minimal contact end-effector is described that may be used for handling microelectronic and similar types of devices. In one example the end-effector has a vacuum pad to generate a lifting force and a standoff fastened to the vacuum pad. The standoff has a plurality of legs with chamfered edges to contact the edges of a microelectronic device to hold the device against the lifting force.

Abstract: An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.

Abstract: Methods of fabricating a microelectronic device comprising forming a microelectronic substrate having a plurality microelectronic device attachment bond pads and at least one interconnection bond pad formed in and/or on an active surface thereof, attaching a microelectronic device to the plurality of microelectronic device attachment bond pads, forming a mold chase having a mold body and at least one projection extending from the mold body, wherein the at least one projection includes at least one sidewall and a contact surface, contacting the mold chase projection contact surface to a respective microelectronic substrate interconnection bond pad, disposing a mold material between the microelectronic substrate and the mold chase, and removing the mold chase to form at least one interconnection via extending from a top surface of the mold material to a respective microelectronic substrate interconnection bond pad.