Patents by Inventor Bassem Bishay

Bassem Bishay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9506821
    Abstract: A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor. A workload factor is determined for the computing device and a fan speed for the computing device is controlled based at least in part upon the approximated ambient air temperature and the workload factor.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: November 29, 2016
    Assignee: EMC IP Holding Company LLC
    Inventors: Michael N. Robillard, Robert M. Beauchamp, Bassem Bishay, David Boudreau, John K. Bowman, John V. Burroughs, Steven R. Cieluch, James W. Espy, Gordon A. Frye, Joseph P. King, Samuel Zeman
  • Publication number: 20070067417
    Abstract: Data storage equipment includes a first storage processor comprising a processing circuit and a collection of packaged integrated circuit devices which has a first set of ports and a second set of ports; a second storage processor; and an interconnect coupled between the first and second storage processors. The processing circuit of the first storage processor is adapted to execute as follows. The collection of packaged integrated circuit devices of the first storage processor is configured to provide (i) communications to a set of storage devices through the first set of ports of the collection of packaged integrated circuit devices and (ii) other communications to the second storage processor through the second set of ports of the collection of packaged integrated circuit devices. Communications is passed between the first storage processor and the set of storage devices through the first set of ports of the collection of packaged integrated circuit devices.
    Type: Application
    Filed: January 3, 2006
    Publication date: March 22, 2007
    Inventors: John Burroughs, Matthew Iong, Bassem Bishay, Douglas Peeke
  • Publication number: 20060292901
    Abstract: Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
    Type: Application
    Filed: April 26, 2005
    Publication date: December 28, 2006
    Inventors: Steven Sardella, Stephen Strickland, Bassem Bishay, Thomas Connor
  • Publication number: 20050186810
    Abstract: Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
    Type: Application
    Filed: April 26, 2005
    Publication date: August 25, 2005
    Inventors: Steven Sardella, Stephen Strickland, Bassem Bishay, Thomas Connor