Abstract: The invention relates to a lithographic apparatus that includes a system configured to condition a radiation beam or project a patterned radiation beam onto a target portion of a substrate. The system includes an optically active device configured to direct the radiation beam or the patterned radiation beam, respectively, and a support structure configured to support the optically active device. The apparatus further includes a gas supply for providing a background gas into the system. The radiation beam or patterned radiation beam react with the background gas to form a plasma that includes a plurality of ions. The support structure includes an element that includes a material that has a low sputtering yield, a high sputter threshold energy, or a high ion implantation yield, to reduce sputtering and the creation of sputtering products.

Abstract: A lithographic projection apparatus includes a radiation system configured to supply a beam of radiation; a mask table provided with a mask holder for holding a mask; a substrate table provided with a substrate holder for holding a substrate; a projection system configured to image an irradiated portion of the mask onto a target portion of the substrate, wherein the projection system is separated from the substrate table by an intervening space that is at least partially evacuated and is delimited at the location of the projection system by a solid surface from which the employed radiation is directed toward the substrate table; the intervening space contains a hollow tube located between the solid surface and the substrate table and situated around the path of the beam of radiation, the tube being configured such that beam of radiation focused by the projection system onto the substrate table does not intercept a wall of the hollow tube; a flushing system is configure to continually flush the inside of the h

Abstract: A lithographic apparatus is configured to project a pattern from a patterning device onto a substrate. The apparatus includes a gas purged sealing aperture extending between at least two different zones of the apparatus, and a gas supplier configured to supply the sealing aperture one or more gases selected from a group including hydrogen, deuterium, heavy hydrogen, deuterated hydrogen, and a mixture of argon and hydrogen.

Abstract: A lithographic apparatus is arranged to project a beam from a radiation source onto a substrate. The apparatus includes an optical element in a path of the beam, a gas inlet for introducing a gas into the path of the beam so that the gas will be ionized by the beam to create electric fields toward the optical element, and a gas source coupled to the gas inlet for supplying the gas. The gas has a threshold of kinetic energy for sputtering the optical element that is greater than the kinetic energy developed by ions of the gas in the electric fields.

Abstract: According to an embodiment, a box for transporting a lithographic patterning device is arranged to cooperate with a lithographic apparatus. The transport box may be provided with a container part having an inner space with a storing position for storing the patterning device and an opening for the transfer of the patterning device. Prior to transfer of the patterning device from the inner space to the apparatus, the inner space is pressurized. The box may also comprise a closure part for closing the opening, and/or a channel system for evacuating and/or feeding gasses from/to the inner space of the box. Other embodiments include a lithographic apparatus comprising and/or configured to cooperate with such a box.

Abstract: The invention relates to a box for transporting lithographic patterning device, the box being arranged to cooperate with a lithographic apparatus. The transport box is provided with a container part having an inner space with a storing position for storing the patterning device and an opening for the transfer of the patterning device. The box also comprises a closure part for closing the opening, and a channel system for evacuating and/or feeding gasses from/to the inner space the box. The invention also relates to a lithographic apparatus configured to cooperate with the transport box.

Abstract: In-situ cleaning of optical components for use in a lithographic projection apparatus can be carried out by irradiating a space within the apparatus containing the optical component with UV or EUV radiation having a wavelength of less than 250 nm, in the presence of molecular oxygen. Generally, the space will be purged with an ozoneless purge gas which contains a small amount of molecular oxygen in addition to the usual purge gas composition. The technique can also be used in an evacuated space by introducing a low pressure of molecular oxygen into the space.