Abstract: An optical transparent adhesive layer with both bubble resistance and yellowing resistance and its application. Specifically, the present discloses a composition, an adhesive layer obtained by further polymerizing the composition has both excellent bubble resistance and excellent yellowing resistance, which can fully satisfy the comprehensive requirements of the market for optical transparent adhesive layers.

Abstract: An optically transparent adhesive compound, a process for producing it and an adhesive transfer tape comprising the adhesive compound. The present invention also relates to the use of the adhesive compound. The optically transparent adhesive compound is for bonding displays, holographic optical elements, lenses and glasses, including: 80 to 100% by weight of at least one (meth)acrylate-containing copolymer A, the copolymer A composed of 15 to 95% by weight of linear alkyl (meth)acrylate monomers, wherein the number of carbon atoms of the alkyl radicals of the linear alkyl (meth)acrylate monomers is 6 to 10, and 5 to 30% by weight of hydroxy group-containing (meth)acrylate monomers. Further, the adhesive compound has a haze value of less than 5% and a transmission at 400 nm to 800 nm of more than 90%, each measured according to ASTM D1003-13.

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Abstract: The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.