Abstract: A nanotwinned structure deposited on a surface of a substrate is provided. The nanotwinned structure includes at least one domain, and the domain includes a plurality of nanotwins. Each of the nanotwins possesses a faced-centered cubic (FCC) structure. The plurality of nanotwins are stacked along the [111] crystallographic axis. Less than 50% of a surface of the nanotwinned structure takes the (111) as the preferred orientation.

Abstract: A nanotwinned structure deposited on a surface of a substrate is provided. The nanotwinned structure includes at least one domain, and the domain includes a plurality of nanotwins. Each of the nanotwins possesses a faced-centered cubic (FCC) structure. The plurality of nanotwins are stacked along the [111] crystallographic axis. Less than 50% of a surface of the nanotwinned structure takes the (111) as the preferred orientation.

Abstract: A high-speed electroplating method is provided. The high-speed electroplating method includes the following steps: providing a substrate containing a conductive layer on its surface; coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist; performing a pretreatment process to clean the substrate; disposing the substrate in an electroplating solution; turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and turning on a jet flow device to agitate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm2 to 5 A/dm2, and then performing a high-speed electroplating process with a plating current density of 6 A/dm2 to 100 A/dm2; depositing a conductive pillar on areas without the dry-film photoresist; and removing the dry-film photoresist being coated on the conductive layer of the substrate.