Patents by Inventor Bau-Ru Lu

Bau-Ru Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10741531
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: August 11, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen
  • Publication number: 20200176270
    Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
    Type: Application
    Filed: February 4, 2020
    Publication date: June 4, 2020
    Inventors: BAU-RU LU, DA-JUNG CHEN, YI-CHENG LIN
  • Patent number: 10636735
    Abstract: The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: April 28, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Jeng-Jen Li, Kaipeng Chiang
  • Patent number: 10593561
    Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: March 17, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Da-Jung Chen, Yi-Cheng Lin
  • Patent number: 10529680
    Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: January 7, 2020
    Assignee: CYNTEC CO., LTD
    Inventors: Bau-Ru Lu, Ming-Chia Wu
  • Patent number: 10433424
    Abstract: An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding body disposed on the plurality of electronic components and, in further embodiments, the heat sink.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: October 1, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Chun-Tiao Liu, Bau-Ru Lu
  • Publication number: 20190254166
    Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 15, 2019
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Pengkai JI, Jianhong ZENG, Yu ZHANG, Shouyu HONG, Jinping ZHOU, BAU-RU LU
  • Patent number: 10373930
    Abstract: The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: August 6, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Jeng-Jen Li, Bau-Ru Lu
  • Patent number: 10373894
    Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 6, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Bau-Ru Lu, Jeng-Jen Li, Kun-Hong Shih, Kaipeng Chiang
  • Patent number: 10297573
    Abstract: A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Ming-Chia Wu, Shao Wei Lu
  • Publication number: 20190150285
    Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 16, 2019
    Inventors: Chun Hsien Lu, Bau-Ru Lu, Kaipeng Chiang
  • Publication number: 20190131286
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.
    Type: Application
    Filed: December 25, 2018
    Publication date: May 2, 2019
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen
  • Patent number: 10212817
    Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: February 19, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun Hsien Lu, Bau-Ru Lu, Kaipeng Chiang
  • Patent number: 10199361
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: February 5, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen
  • Patent number: 10128214
    Abstract: The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: November 13, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Ming-Chia Wu, Shao Wei Lu
  • Publication number: 20180308829
    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
    Type: Application
    Filed: June 28, 2018
    Publication date: October 25, 2018
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen
  • Patent number: 10063098
    Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: August 28, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Huei-Ren You, Bau-Ru Lu, Kaipeng Chiang
  • Publication number: 20180240781
    Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.
    Type: Application
    Filed: April 24, 2018
    Publication date: August 23, 2018
    Inventors: BAU-RU LU, MING-CHIA WU, SHAO WEI LU
  • Publication number: 20180233380
    Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.
    Type: Application
    Filed: April 18, 2018
    Publication date: August 16, 2018
    Inventors: BAU-RU LU, DA-JUNG CHEN, YI-CHENG LIN
  • Patent number: 10034379
    Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 24, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen