Patents by Inventor Bau Shun Huang

Bau Shun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked rectifiers in a package
    Patent number: 9761507
    Abstract: A rectifier package is provided, which comprises a first rectifier die having an anode and a cathode conductively bonded to a first conductive film on a first surface. The rectifier package also comprises a second rectifier die having an anode and a cathode conductively bonded to the first conductive film on a second surface, which is opposite to the first surface. The first conductive film is in contact with both anodes or both cathodes of the first rectifier die and the second rectifier die.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: September 12, 2017
    Assignee: Diodes Incorporated
    Inventors: Pin-Hao Huang, Tim C. Chen, Yeng-Liang Lin, Bau Shun Huang