Abstract: A carrying device is provided. The carrying device includes a stand, an upper clamp connected to the stand, a lower clamp assembled to the stand, a manipulation mechanism assembled to the stand and interlinked with the lower clamp, and a supporting column assembled to the lower clamp. The manipulation mechanism can drive the lower clamp to move relative to the upper clamp, and the upper clamp and the lower clamp jointly define a receiving space therebetween. The supporting column is movable relative to the lower clamp, so that the carrying device can be adjusted in a first clamping mode or a second clamping mode. When the carrying device is in the first clamping mode, the supporting column is located in the receiving space and faces toward the upper clamp, so that the supporting column and the upper clamp can jointly clamp a plate part of a first structure.

Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.

Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.

Abstract: A supporting device of the invention comprises a main body, a shaft, and a rotating component. The main body comprises a sliding path and an opening. The shaft and the rotating component can slide along the sliding path. The rotating component is connected to the shaft. The shaft and at least a part of the rotating component can then be extended beyond the main body through the opening. Through the aforementioned configuration, the shaft can rotate with respect to the main body when the shaft and at least a part of the rotating component are extended beyond the main body.

Abstract: A supporting device of the invention comprises a main body, a shaft, and a rotating component. The main body comprises a sliding path and an opening. The shaft and the rotating component can slide along the sliding path. The rotating component is connected to the shaft. The shaft and at least a part of the rotating component can then be extended beyond the main body through the opening. Through the aforementioned configuration, the shaft can rotate with respect to the main body when the shaft and at least a part of the rotating component are extended beyond the main body.