Patents by Inventor Beak Myeong SEONG

Beak Myeong SEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11747234
    Abstract: The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: September 5, 2023
    Inventor: Beak Myeong Seong
  • Publication number: 20220065737
    Abstract: The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 3, 2022
    Inventor: Beak Myeong SEONG
  • Patent number: 11004577
    Abstract: A cable type liquid leak sensor includes a first cable unit having a first detection line for detecting a leaking liquid and a first power line in parallel twisted with the first detection line for supplying a power source, a second cable unit having a second detection line for detecting a leaking liquid and a second power line in parallel twisted with the second detection line for supplying a power source, a first fixing unit formed to surround the outside of the first cable unit by a thread made of a chemical-resistant or drug-tolerant material, a second fixing unit formed to surround the outside of the second cable unit by a thread made of a chemical-resistant or drug-tolerant material, and a connection unit having both sides braided to couple the first and second fixing units so that the first and second cable units maintain a given interval.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: May 11, 2021
    Inventor: Beak Myeong Seong
  • Publication number: 20210080338
    Abstract: The present disclosure relates to a liquid leak sensor and, more particularly, to a liquid leak sensor for preventing damage to metallic electrodes attributable to a chemical solution, which are formed to detect the state of a leaking liquid on the top surface of a film. The liquid leak sensor includes a lower film in which at least one pair of metallic electrodes are formed on a top surface thereof in parallel at an interval in order to detect a leaking liquid, and a graphene ink layer coated to cover the electrodes. The graphene ink layer is formed by mixing graphene of 5 to 10 wt %, a binder of 30 to 50 wt %, 2-ethoxy ethanol of 20 to 25 wt %, DPGDME of 20 to 25 wt %, and a dispersant 5 to 10 wt % and then printing the mixture on the electrodes using graphene ink fabricated by high-pressure dispersion.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 18, 2021
    Inventor: Beak Myeong SEONG