Patents by Inventor Beat Zumbuehl

Beat Zumbuehl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonder and/or wire bonder with a device for holding down a substrate
    Patent number: 6585145
    Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: July 1, 2003
    Assignee: ESEC Trading SA
    Inventors: Stefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann
  • Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
    Patent number: 6435492
    Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: August 20, 2002
    Assignee: ESEC Trading SA
    Inventors: Stefan Behler, Reto Schubiger, Beat Zumbuehl
  • DIE BONDER AND/OR WIRE BONDER WITH A SUCTION DEVICE FOR PULLING FLAT AND HOLDING DOWN A CURVED SUBSTRATE
    Publication number: 20020093130
    Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.
    Type: Application
    Filed: December 8, 2000
    Publication date: July 18, 2002
    Inventors: Stefan Behler, Reto Schubiger, Beat Zumbuehl
  • Die bonder and/or wire bonder with a device for holding down a substrate
    Publication number: 20020066765
    Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.
    Type: Application
    Filed: December 4, 2001
    Publication date: June 6, 2002
    Inventors: Stefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann