Abstract: A polymer composition can be used for selective absorbing sintering, SAS, or selective inhibition sintering, SIS. The polymer has open mesopores and the cumulative pore volume distribution of the mesopores, measured to DIN 66134, is at least 0.01 cm3/g.

Abstract: A polymer composition can be used for selective absorbing sintering, SAS, or selective inhibition sintering, SIS. The polymer has open mesopores and the cumulative pore volume distribution of the mesopores, measured to DIN 66134, is at least 0.01 cm3/g.

Abstract: A polyamide powder for selective absorbing sintering, SAS, or selective inhibition sintering, SIS. The polyamide powder has a solution viscosity to ISO 307 of 1.8 to 2 and a rise in the solution viscosity of 0% to 25% when it is subjected to a temperature 20° C. below its melting temperature under air for 20 hours.

Abstract: A polymer composition can be used in selective absorbing sintering, SAS, or selective inhibition sintering, SIS, methods. The polymer of the polymer composition has open mesopores, where a cumulative pore volume distribution of the mesopores, measured according to DIN 66134, is at least 0.01 cm3/g.

Abstract: A polyamide powder for selective absorbing sintering, SAS, or selective inhibition sintering, SIS. The polyamide powder has a solution viscosity to ISO 307 of 1.8 to 2 and a rise in the solution viscosity of 0% to 25% when it is subjected to a temperature 20° C. below its melting temperature under air for 20 hours.

Abstract: A polymer composition can be used in selective absorbing sintering, SAS, or selective inhibition sintering, SIS, methods. The polymer of the polymer composition has open mesopores, where a cumulative pore volume distribution of the mesopores, measured according to DIN 66134, is at least 0.01 cm3/g.

Abstract: A polyamide powder for selective absorbing sintering, SAS, or selective inhibition sintering, SIS. The polyamide powder has a solution viscosity to ISO 307 of 1.8 to 2 and a rise in the solution viscosity of 0% to 25% when it is subjected to a temperature 20° C. below its melting temperature under air for 20 hours.

Abstract: A decorative film having an outer layer containing a polyamide composition with the following components: a) from 50 to 100 parts by weight of polyamide prepared from: ?) from 70 to 100 mol % of diamine selected from m-xylylenediamine, p-xylylenediamine and mixtures thereof, ?) from 0 to 30 mol % of other diamines having from 6 to 14 carbon atoms, and ?) from 70 to 100 mol % of aliphatic dicarboxylic acids having from 10 to 18 carbon atoms and ?) from 0 to 30 mol % of other dicarboxylic acids having from 6 to 9 carbon atoms, and b) from 0 to 50 parts by weight of another polyamide, where a) and b) total 100, having good chemicals resistance, good stress cracking resistance, improved scratch resistance, and improved gloss.