Patents by Inventor BEATRIZ JIMENEZ

BEATRIZ JIMENEZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and multi-level interposer with RF sloped via and related method
    Patent number: 12205880
    Abstract: An electronic device may include an IC, a grid array substrate, and a multi-level interposer coupled between the IC and the grid array substrate. The multi-level interposer may have dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and an RF sloped via including a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and a respective sloped lateral metal ground layer adjacent each side of the sloped metal signal layer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: January 21, 2025
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Matt Bauer, Timothy Clingenpeel, Beatriz Jimenez
  • ELECTRONIC DEVICE AND MULTI-LEVEL INTERPOSER WITH RF SLOPED VIA AND RELATED METHOD
    Publication number: 20230298988
    Abstract: An electronic device may include an IC, a grid array substrate, and a multi-level interposer coupled between the IC and the grid array substrate. The multi-level interposer may have dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and an RF sloped via including a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and a respective sloped lateral metal ground layer adjacent each side of the sloped metal signal layer.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Inventors: MATT BAUER, TIMOTHY CLINGENPEEL, BEATRIZ JIMENEZ