Patents by Inventor Beau Guidry

Beau Guidry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for heatsink to rail thermal interface enhancement
    Patent number: 10791652
    Abstract: Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: September 29, 2020
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Bernie J. Gilley, Brandon T. Dubas, Beau Guidry
  • SYSTEMS AND METHODS FOR HEATSINK TO RAIL THERMAL INTERFACE ENHANCEMENT
    Publication number: 20190380225
    Abstract: Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.
    Type: Application
    Filed: June 12, 2018
    Publication date: December 12, 2019
    Inventors: Jason Thompson, Bernie J. Gilley, Brandon T. Dubas, Beau Guidry