Patents by Inventor Bedri Cetiner

Bedri Cetiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060222101
    Abstract: An adaptive MIMO communications system includes a multifunctional reconfigurable antenna with a selectively alterable effective physical antenna array configuration and radiation/polarization properties, which configuration and properties is a component in the optimization of the adaptive system parameters. The multifunctional reconfigurable antenna comprises a plurality of antenna components and a plurality of selectively controllable switches coupling selected ones of the plurality of antenna components together into a multifunctional reconfigurable subarray of antenna components. A processing unit coupled to the multifunctional reconfigurable antenna determines communication channel conditions for generating adaptive control signals to the plurality of selectively controllable switches to selectively apply a selected space-time coding protocol or a selected beam forming protocol together on the plurality of antenna components depending on channel conditions.
    Type: Application
    Filed: November 22, 2005
    Publication date: October 5, 2006
    Inventors: Bedri Cetiner, Hamid Jafarkhani
  • Patent number: 7084724
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: August 1, 2006
    Assignee: The Regents of the University of California
    Inventors: Bedri A. Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis
  • Publication number: 20050248423
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Application
    Filed: March 14, 2005
    Publication date: November 10, 2005
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Publication number: 20050062653
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Application
    Filed: December 31, 2003
    Publication date: March 24, 2005
    Inventors: Bedri Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis