Abstract: A semiconductor device (30,30?) includes a semiconductor die (32, 32?) having bonding pads (34, 34?) and ball bumps (38, 38?). Each of the ball bumps (38, 38?) has a base portion (40, 40?) and a protruding portion (42, 42?). The semiconductor die (32, 32?) is mounted on a lead frame having lead posts (44, 44?) such that each of the lead posts (44, 44?) is aligned to a respective one of the ball bumps (38, 38?). Each of the lead posts (44, 44?) has an opening (46, 46?) that extends from a first surface of the lead post (44, 44?) through to a second surface of the lead post (44, 44?). The opening (46, 46?) contains the protruding portion (42, 42?) of the respective one of the bumps (38, 38?) to facilitate alignment and bonding. A rivet (50, 50?) is formed from the protruding portion (42, 42?) of the respective one of the plurality of bumps (38, 38?) on the surface of the lead posts (44, 44?), which provides for bonding and securing of the lead posts (44, 44?) to the semiconductor die (32, 32?).