Abstract: A semiconductor device can include a semiconductor substrate singulated from a device wafer having had multiple semiconductor devices formed thereon. The semiconductor substrate can include a first corner, a first sidewall extends in a first direction from the first corner, and a second sidewall extending in a second direction from the first corner. The first sidewall can include a first laser modification extending along the first direction and the second sidewall can include a second laser modification extending along the second direction. A portion of the second sidewall between the first corner and the second laser modification can (i) exclude laser modification, or (ii) the second laser modification can be offset from the first corner along the second direction.