Abstract: A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.

Abstract: A stacked testing assembly (100) includes a microfluidic cartridge (10) for analyzing a fluid sample and a testing setup, said microfluidic cartridge includes a number of layers (1, 2) stacked in a height direction with many different kinds of combinations, said testing setup (20) is capable of assembling and testing all kinds of said layers combinations with no change to the setup.

Abstract: A stacked testing assembly (100) includes a microfluidic cartridge (10) for analyzing a fluid sample and a testing setup, said microfluidic cartridge includes a number of layers (1, 2) stacked in a height direction with many different kinds of combinations, said testing setup (20) is capable of assembling and testing all kinds of said layers combinations with no change to the setup.

Abstract: An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.

Abstract: An LED lead frame includes an insulative base having a cavity on one side. A pair of conductive leads each has an end exposed in the cavity and another end extended out of insulative base. An electrostatic discharge protection device is insert-molded in the insulative base with only one side thereof exposed out of the insulative base, and is electrically interconnecting with the conductive leads.

Abstract: An electrical connector assembly includes an electrical connector, a chip located and a printed circuit board located at opposite sides of the anisoptropic conductive film. The electrical connector has an anisoptropic conductive film and a loading mechanism. The anisoptropic conductive film includes an adhesive and a number of conductive particles dispersed in the adhesive. The anisoptropic conductive film has conductivity only in a thicknesswise direction by pressing. The loading mechanism can exert pressure on the anisoptropic conductive film so that the chip and the printed circuit board electrically couples with each other.

Abstract: An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.

Abstract: An LED lead frame includes an insulative base having a cavity on one side. A pair of conductive leads each has an end exposed in the cavity and another end extended out of insulative base. An electrostatic discharge protection device is insert-molded in the insulative base with only one side thereof exposed out of the insulative base, and is electrically interconnecting with the conductive leads.

Abstract: Provided herewith a socket connector adapted to be mounted on a substrate having a conductive element is provided, and comprises an insulative housing, the housing having an exterior side adapted to face the substrate. A stamped contact is formed from a sheet of conductive material and is adapted to mate with a conductive component and extending substantially to the exterior side of the housing. The contact has a connection portion and wherein a substantially dried preparation of oxidation retarding and solder affinity deployed on the terminal portion before the contact assembled into the connector. The connector further includes a body of reflowable, electrically conductive material associated adjacent to the connection portion adjacent the exterior side of the housing.

Abstract: An LED lead frame comprises an insulative housing including a top surface, a bottom surface, and four side surfaces connected the top surface and the bottom surface, and a cavity recessed from the top surface. A pair of conductive leads each has a portion embedded into the insulative housing and another portion exposed out of the insulative housing. The another portion includes an end portion extending downwardly along one of the side surface, a bottom soldering portion extending continuously from the end portion along the bottom surface, and a pair of side soldering portions extending upwardly from two ends of the bottom soldering portion along another two opposite side surfaces. The bottom soldering portion and the side soldering portions can be used as an alternative mounting surface.

Abstract: An LED lead frame includes a housing having a cavity for receiving an LED chip, and a pair of conductive leads mounted with the housing. Each lead includes an embedded section retained in the housing. The embedded section is plated with a silver layer thereon and a water-repellent layer disposed on the silver layer.

Abstract: An electrical connector assembly includes an electrical connector, a chip located and a printed circuit board located at opposite sides of the anisoptropic conductive film. The electrical connector has an anisoptropic conductive film and a loading mechanism. The anisoptropic conductive film includes an adhesive and a number of conductive particles dispersed in the adhesive. The anisoptropic conductive film has conductivity only in a thicknesswise direction by pressing. The loading mechanism can exert pressure on the anisoptropic conductive film so that the chip and the printed circuit board electrically couples with each other.

Abstract: A lead frame (100) of a light emitting diode (LED) comprises a housing (2) and a plurality of electrodes (1) arranged in the housing (2). The housing (2) has a cavity (21) with an inner circumferential surface for reflecting light from a LED chip mounted in the cavity (21). The inner circumferential surface is coated with a reflective coat (22) having a plurality of ultraviolet light reflective particles (23).

Abstract: A socket connector (100) adapted for electrically connecting a package to a printed circuit board comprises a substrate (2) and a plurality of contacts (3), the substrate (2) comprises a top surface (21), a bottom surface (22) opposite to the top surface (21) and a plurality of passageways (211) impenetrate the top surface (21) and the bottom surface (22), the contact (3) is partly received in the passageway (211) and comprises a body portion (31), at least one leg (33) extends downwardly from the body portion (31) and a spring arm (32) extends upwardly from the body portion (31), the body portion (31) is attached to the top surface of the substrate (2) and the leg (33) goes through the passageway (211) to position the contact (3) on the substrate (2).

Abstract: A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.

Abstract: An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.

Abstract: A connector assembly includes a PCB, an insulative housing mounted on the PCB with a plurality of contacts received therein, a retention module mounted on the PCB and surrounding the insulative housing, and a backplate mounted below the PCB for reinforcing the retention module. The backplate includes a base plate having an upper surface toward a backside surface of the PCB and an insulative coating deposited on the upper surface to prevent the backplate from short-circuiting electrical components of mounted on the backside surface of the PCB.

Abstract: An electrical connector is for electrically connecting an electronic package with a circuit substrate. The connector includes a housing with a plurality of conductive terminals received therein, a fastening device for securing the electronic package. The fastening device includes a pressing member for pressing and securing the electronic package and a retaining member for securing the pressing member. At least one of the pressing member, the retaining member are produced from ferrite stainless steel material, and has a layer of high temperature resistant organic thin film thereon.

Abstract: A connector assembly includes a PCB, an insulative housing mounted on the PCB with a plurality of contacts received therein, a retention module mounted on the PCB and surrounding the insulative housing, and a backplate mounted below the PCB for reinforcing the retention module. The backplate includes a base plate having an upper surface toward a backside surface of the PCB and an insulative coating deposited on the upper surface to prevent the backplate from short-circuiting electrical components of mounted on the backside surface of the PCB.

Abstract: A solder ball is adapted for a ball grid array socket and comprises a core portion (1) and a layer (2) of solder alloy coated an outer surface of the core portion. The core portion is consisting of tin essentially, and the layer of solder alloy contains at least two metal materials.