Patents by Inventor Beenvih Jln

Beenvih Jln has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally stable crystalline defect-free germanium boned to silicon and silicon dioxide
    Publication number: 20040106268
    Abstract: A wafer pair comprising a substantially defect-free germanium wafer and methods of making the same. The wafer pair comprises the substantially defect-free germanium wafer directly bonded to a silicon wafer. The method of making the wafer pair comprises placing the silicon wafer in a wafer-bonding chamber, placing the germanium wafer on top or on bottom of the silicon wafer, and applying a local force to either the germanium wafer or to the silicon wafer to initiate bonding of the germanium wafer to the silicon wafer. The bonding occurs under a temperature ranging from about 23° C. to about 600° C. and under a vacuum condition inside a wafer-bonding chamber.
    Type: Application
    Filed: June 30, 2003
    Publication date: June 3, 2004
    Inventors: Mohamad A. Shaheen, Beenvih Jln, Robert S. Chau