Abstract: According to various embodiments, a method for monitoring an electronic device includes: determining, based at least on thermal telemetry data associated with the electronic device, a thermal resistance between a cooling medium and a heat-generating component of the electronic device; and based at least on the thermal resistance, determining an operational status of the electronic device.

Abstract: Systems are disclosed that support improved cooling of processing units and other semiconductor dies in a datacenter or elsewhere. An example of such a system may include a pedestal configured to support a semiconductor package, the pedestal having a first geometry with a contact surface and a second geometry with a pressure surface, where the pressure surface is offset from the contact surface and applies pressure to the semiconductor package to mitigate the negative effects on heat transfer of thermo-mechanical warpage of the semiconductor package.

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving a first hotspot temperature measurement and a second hotspot temperature measurement with respect to a hotspot. The first hotspot temperature measurement is based on a first temperature measurement received from a first thermal sensor, and a first thermal offset associated with the first thermal sensor. The second hotspot temperature measurement is based on a second temperature measurement received from a second thermal sensor, and a second thermal offset associated with the second thermal sensor. The operations further include determining, using at least the first and second hotspot temperature measurements, a generalized hotspot temperature measurement of the hotspot.

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Abstract: An apparatus includes an interface and thermal management circuitry (TMC). The interface is configured to receive multiple measurements of multiple temperatures measured in multiple locations of an electronic system, respectively. The TMC is configured to: (a) convert the multiple measurements into multiple pulse width modulation (PWM) parameters, (b) calculate, based on at least the multiple PWM parameters, one or more PWM signals, and (c) control the multiple temperatures by applying the one or more PWM signals to one or more cooling devices.

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.

Abstract: A stiffener ring for an ASIC package has a non-uniform cross-section.

Abstract: A stiffener ring for an ASIC package has a non-uniform cross-section.

Abstract: Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions of the top cage member, and the bottom cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the bottom cage member, and the heat dissipation unit includes one or more heat dissipation elements allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.

Abstract: Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions of the top cage member, and the bottom cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the bottom cage member, and the heat dissipation unit includes one or more heat dissipation elements allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.