Abstract: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: This disclosure provides various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter including one or more differential power amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: This disclosure provides various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter including one or more differential power amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: This disclosure provides various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

Abstract: An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

Abstract: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: An electronic device may include baseband circuitry coupled to antennas over a communication path that includes signal paths on a first substrate, a second substrate, and a third substrate. The antennas may be disposed on the third substrate. A wireless connector may couple the paths on the third substrate to the paths on the second substrate. The wireless connector may include a first transceiver and first antenna on the third substrate and a second transceiver and second antenna on the second substrate. The wireless connector may include one or more dielectric layers disposed between the first antenna and the second antenna. The layers may form a smooth impedance transition between the first antenna and the second antenna. The layers may include one or two angled layers that redirect wireless signals between the first and second antennas to allow the first and second substrates to be offset within the device.

Abstract: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.

Abstract: An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Abstract: A microstrip-fed antenna is disclosed having a first dielectric substrate and a second dielectric substrate. The second dielectric substrate is disposed on the first dielectric substrate and the first dielectric substrate has a relative permittivity greater than or equal to the second dielectric substrate. The antenna further includes a microstrip line formed in the second dielectric substrate and a metal layer formed in the second dielectric substrate. The metal layer is positioned between the microstrip line and the first dielectric substrate and includes a slot.

Abstract: A microstrip-fed antenna is disclosed having a first dielectric substrate and a second dielectric substrate. The second dielectric substrate is disposed on the first dielectric substrate and the first dielectric substrate has a relative permittivity greater than or equal to the second dielectric substrate. The antenna further includes a microstrip line formed in the second dielectric substrate and a metal layer formed in the second dielectric substrate. The metal layer is positioned between the microstrip line and the first dielectric substrate and includes a slot.