Patents by Inventor Behzad Shamlou

Behzad Shamlou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Robot blade for handling of semiconductor substrates
    Patent number: 6199927
    Abstract: The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the substrate handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450° C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant.
    Type: Grant
    Filed: January 21, 1999
    Date of Patent: March 13, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Behzad Shamlou, Wen Chiang Tu, Xuyen Pham, Yu Chang, Daniel O. Clark, Shun Wu
  • Robot blade for handling of semiconductor substrate
    Patent number: 6024393
    Abstract: The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the wafer handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450.degree. C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: February 15, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Behzad Shamlou, Wen Chiang Tu, Xuyen Pham, Yu Chang, Daniel O. Clark, Shun Wu