Patents by Inventor Bei Fu

Bei Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250192422
    Abstract: An antenna assembly includes a first antenna element disposed on a surface that is of a second dielectric layer that is distal from a first dielectric layer. A second antenna element is disposed between an intermediate dielectric layer and the first dielectric layer, and a third antenna element is disposed between the intermediate dielectric layer and the second dielectric layer.
    Type: Application
    Filed: February 19, 2025
    Publication date: June 12, 2025
    Inventors: Tongjie Li, Zhiguo Huang, Bei Fu
  • Patent number: 11171454
    Abstract: The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: November 9, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tongjie Li, Ke Ai, Bei Fu
  • Publication number: 20210104844
    Abstract: The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended.
    Type: Application
    Filed: November 27, 2017
    Publication date: April 8, 2021
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tongjie Li, Ke Ai, Bei Fu