Abstract: Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.

Abstract: The present invention provides a TOF camera module and electronic device and an assembly method, wherein the TOF camera module includes a floodlight module, a receiving module and a plurality of electronic components, and a part of the electronic components is conductively connected to the floodlight module, a part of the electronic components is conductively connected to the receiving module, and the receiving module provides a first circuit board and at least one of the plurality of electronic components is located on a back side of the first circuit board of the receiving module.

Abstract: Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.