Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 1 /Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 l/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include an alkyl(meth)acrylate ester having 1 to 24 carbon atoms in the alkyl group and a free-radical generating initiator. Within a temperature range of between ?30° C. to 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed 2 MPa, a shear creep compliance (J) of at least 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between 50 kPa and 500 kPa, and a strain recovery of at least 50% at at least one point of applied shear stress within the range of 5 kPa to 500 kPa within 1 minute after removing the applied shear stress. In a preferred embodiment, the flexible device is a flexible electronic display.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors including an acrylic block copolymer including (a) at least two A block polymeric units that are the reaction product of a first monomer composition comprising an alkyl methacrylate, an aralkyl methacrylate, an aryl methacrylate, or a combination thereof, wherein each A block has a Tg of at least about 50° C., and wherein the acrylic block copolymer comprises about 5 to about 50 weight percent A block, and (b) at least one B block polymeric unit that is the reaction product of a second monomer composition comprising an alkyl (meth)acrylate, a heteroalkyl (meth)acrylate, a vinyl ester, or a combination thereof, wherein the B block has a Tg no greater than about 10° C., and wherein the acrylic block copolymer comprises about 50 to about 95 weight percent B block. Within a temperature range of between about ?30° C. to about 90° C.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include an alkyl(meth)acrylate ester having 1 to 24 carbon atoms in the alkyl group and a free-radical generating initiator. Within a temperature range of between ?30° C. to 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed 2 MPa, a shear creep compliance (J) of at least 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between 50 kPa and 500 kPa, and a strain recovery of at least 50% at at least one point of applied shear stress within the range of 5 kPa to 500 kPa within 1 minute after removing the applied shear stress. In a preferred embodiment, the flexible device is a flexible electronic display.

Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors in eluding at least one of a physically cross-linked silicone elastomer and a covalently cross-linked silicone elastomer forming reagent mixture, and a MQ resin. Within a temperature range of between about ?30 C to about 90 C, the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.

Abstract: Particles having a first region and a second region surrounding the first region where the second region includes a copolymer extending across a thickness of the second region are described. The volume of the second region is at least 75 percent of the volume of the particle. The particles have a composition and a refractive index that each vary across the thickness of the second region.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: Pressure sensitive adhesives comprising an acrylate polymer and surface-modified nanoparticles are described. The surface-modified nanoparticles comprise a nanoparticle having a silica surface and surface modifying groups covalently attached to the silica surface. At least one surface-modifying group is a polymeric silane surface modifying group. At least one surface-modifying group is a non-polymeric silane surface modifying group. Methods of preparing such adhesives, including their exposure to UVA and UVC radiation are also described.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: Compositions such as photoresists and microfabrication processes are provided that can produce high-fidelity microfabricated structures. The provided photoresists can have reduced swelling during the development phase and can give tight tolerances for products, such as microneedles, that can be used, for example, in the medical field. The provided compositions include a photoresist, a photoinitiator system dispersed in the photoresist, and a polymer-tethered nanoparticle dispersed in the photoresist. The photoresist can be a negative photoresist and the photoinitiator system can include a two-photoinitiator system. The polymer-tethered nanoparticle can include an acrylic polymer and, in some embodiments, can include poly(methyl methacrylate). The nanoparticles can include silica.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

Abstract: Compositions such as photoresists and microfabrication processes are provided that can produce high-fidelity microfabricated structures. The provided photoresists can have reduced swelling during the development phase and can give tight tolerances for products, such as microneedles, that can be used, for example, in the medical field. The provided compositions include a photoresist, a photoinitiator system dispersed in the photoresist, and a polymer-tethered nanoparticle dispersed in the photoresist. The photoresist can be a negative photoresist and the photoinitiator system can include a two-photoinitiator system. The polymer-tethered nanoparticle can include an acrylic polymer and, in some embodiments, can include poly(methyl methacrylate). The nanoparticles can include silica.

Abstract: A pre-adhesive syrup copolymer composition comprising an acid functional acrylate solute copolymer, a monomer solvent mixture, and a polyaziridine crosslinking agent is disclosed.

Abstract: Adhesive articles having surface-modified nanoparticles located on or near at least one surface of a layer of pressure sensitive adhesive are described. Methods of making such adhesive articles are also described.