Patents by Inventor Bemly Sujeewa Randeniya

Bemly Sujeewa Randeniya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9508694
    Abstract: Relatively small, electrically isolated segments of LED light sheets are fabricated having an anode terminal and a cathode terminal. The segments contain microscopic printed LEDs that are connected in parallel by two conductive layers sandwiching the LEDs. The top conductive layer is transparent. Separately formed from the light sheet segments is a flexible, large area conductor backplane having a single layer or multiple layers of solid metal strips (traces). The segments are laminated over the backplane's metal pattern to supply power to the segment terminals. An adhesive layer secures the segments to the backplane. The metal pattern may connect the segments in series, or parallel, or form an addressable circuit for a display. The segments may be on a common substrate or physically separated from each other prior to the lamination.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: November 29, 2016
    Assignee: Nthdegree Technologies Worldwide Inc.
    Inventors: Bradley Steven Oraw, Bemly Sujeewa Randeniya
  • Publication number: 20160035924
    Abstract: Relatively small, electrically isolated LED tiles or PV tiles are fabricated having an anode electrode and a cathode electrode. The LED tiles contain microscopic printed LEDs that are connected in parallel by two conductive layers sandwiching the LEDs. The top conductive layer is transparent. Separately formed from the tiles is a large area backplane having a single layer or multiple layers of metal traces connected to backplane electrodes corresponding to the tile electrodes. Multiple tiles are laminated over the backplane's metal pattern to connect the tile electrodes to the backplane electrodes, such as by a conductive adhesive. The backplane metal pattern may connect the tiles in series and/or parallel, or form an addressable circuit for a display. Groups of tiles may be physically connected to each other prior to the lamination to ease handling and alignment. The backplane has power terminals electrically coupled to the metal traces for receiving power.
    Type: Application
    Filed: October 15, 2015
    Publication date: February 4, 2016
    Inventors: Bradley Steven Oraw, Bemly Sujeewa Randeniya, Travis Thompson
  • Publication number: 20150255438
    Abstract: Relatively small, electrically isolated segments of LED light sheets are fabricated having an anode terminal and a cathode terminal. The segments contain microscopic printed LEDs that are connected in parallel by two conductive layers sandwiching the LEDs. The top conductive layer is transparent. Separately formed from the light sheet segments is a flexible, large area conductor backplane having a single layer or multiple layers of solid metal strips (traces). The segments are laminated over the backplane's metal pattern to supply power to the segment terminals. An adhesive layer secures the segments to the backplane. The metal pattern may connect the segments in series, or parallel, or form an addressable circuit for a display. The segments may be on a common substrate or physically separated from each other prior to the lamination.
    Type: Application
    Filed: December 3, 2014
    Publication date: September 10, 2015
    Inventors: Bradley Steven Oraw, Bemly Sujeewa Randeniya
  • Publication number: 20140230207
    Abstract: A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 21, 2014
    Applicant: NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
    Inventors: Bradley Steven Oraw, Bemly Sujeewa Randeniya, Eric William Kahrs