Abstract: In EUV lithography apparatuses (10), it is proposed, in order to lengthen the lifetime of contamination-sensitive components, to arrange them in a protection module. The protection module comprises a housing (23-29) having at least one opening (37-47), in which at least one component (13a, 13b, 15, 16, 18, 19) is arranged and at which one or more gas feeds (30-36) are provided in order to introduce a gas flow into the housing (23-29), which emerges through the at least one opening (37-47). In order to effectively prevent contaminating substances from penetrating into the protection module, a light source (48-56) is arranged at the at least one opening (37-47), which light source illuminates the opening (37-47) with one or more wavelengths by which the contaminating substances can be dissociated before they penetrate through the opening (37-47).

Abstract: A heat exchanger for use with an electronic heat pump including a plurality of narrow channels defined between adjacent walls. The channel heights are between 0 mm and 10 m to ensure thermal resistance is below 0.1° C./W for a 40 mm heat exchange width. The acceptable geometry for the channels is described by one or more variables, including the minimum number of channels and the minimum wall thickness for a given channel width. These variables control the surface area of the boundary of the channels in direct contact with the fluid and the cross-sectional area available for transmission of heat by conduction up the walls of the channels.

Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.

Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.

Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.