Abstract: This invention provides a system and method for using an area scan sensor of a vision system, in conjunction with an encoder or other knowledge of motion, to capture an accurate measurement of an object larger than a single field of view (FOV) of the sensor. It identifies features/edges of the object, which are tracked from image to image, thereby providing a lightweight way to process the overall extents of the object for dimensioning purposes. Logic automatically determines if the object is longer than the FOV, and thereby causes a sequence of image acquisition snapshots to occur while the moving/conveyed object remains within the FOV until the object is no longer present in the FOV. At that point, acquisition ceases and the individual images are combined as segments in an overall image. These images can be processed to derive overall dimensions of the object based on input application details.

Abstract: The present invention pertains to a package structure of multi-chips light-emitting module, wherein via the packaging technology of semiconductor, a plurality of light emitting diode chips are installed on the disposing portion of a lead frame, and the chips and the lead frame are interconnected with bond wires, and then an encapsulant is used to cover the chips, bond wires and the disposing portion to form a package structure. The light-emitting module packaged with the structure having the disposing portion can be applied to the light source of lightening, indicator and alarm, etc., and not only has high light permeability, but also has the function of diverging as well as focusing the light source.