Patents by Inventor Ben Cook
Ben Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240350883Abstract: A game board including a top panel and a plank and a game that comprises one or more of the game boards. A plank extends from the back end of the game board. The top surface of the game board is flat and includes a surrounding area and one or more target areas. A projectile comprising a weighted ball is thrown by players onto the top panel or plank surface. A method for playing the game involves two to four players who will throw or roll the balls to land on the desired location of the top panel or plank area to score points toward winning the game. The game includes multiple rounds.Type: ApplicationFiled: April 19, 2024Publication date: October 24, 2024Applicant: Double G Games LLCInventors: Gary Graham, Hudson Graham, James Faucher, Luke Lundquist, Dan Cook, Ben Allen, Isaac Allen
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Patent number: 11958627Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).Type: GrantFiled: February 14, 2020Date of Patent: April 16, 2024Assignee: MBDA UK LIMITEDInventors: Edwin John William Bowden-Peters, Ben Cook
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Patent number: 11417725Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: GrantFiled: November 25, 2020Date of Patent: August 16, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Publication number: 20220135226Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).Type: ApplicationFiled: February 14, 2020Publication date: May 5, 2022Inventors: Edwin John William BOWDEN-PETERS, Ben COOK
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Patent number: 11059425Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.Type: GrantFiled: December 3, 2018Date of Patent: July 13, 2021Assignee: JAGUAR LAND ROVER LIMITEDInventors: Edward Simmons, Christopher Bellamy, Kripa Balachandran, James Pickup, Daniel Tait, Ben Cook, Emily Greenhalgh, Paul Kellitt, Christopher Brown, Matthew Atkinson, Thomas Booker, Lucy Wakefield, David Warburton
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Publication number: 20210083047Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Patent number: 10854712Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: GrantFiled: February 4, 2019Date of Patent: December 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Publication number: 20190176711Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.Type: ApplicationFiled: December 3, 2018Publication date: June 13, 2019Inventors: Edward SIMMONS, Christopher BELLAMY, Kripa BALACHANDRAN, James PICKUP, Daniel TAIT, Ben COOK, Emily GREENHALGH, Paul KELLITT, Christopher BROWN, Matthew ATKINSON, Thomas BOOKER, Lucy WAKEFIELD, David WARBURTON
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Publication number: 20190172907Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: ApplicationFiled: February 4, 2019Publication date: June 6, 2019Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Patent number: 10199461Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: GrantFiled: October 27, 2015Date of Patent: February 5, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Publication number: 20180326914Abstract: Embodiments of the present invention provide a support structure for a vehicle seat comprising an integrated storage cavity, which may be used to store personal items such as an umbrella. The support structure comprises a reinforcement structure and a moulding, the reinforcement structure being located at least partially within the moulding.Type: ApplicationFiled: May 10, 2018Publication date: November 15, 2018Inventors: Lauren COYLE, Mike HORSBURGH, Stefano LONGOBARDI, Richard HARRY, Andrew ROBINSON, Christopher BROWN, Ben COOK, Plamen PETROV
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Publication number: 20170117356Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: ApplicationFiled: October 27, 2015Publication date: April 27, 2017Applicant: Texas Instruments IncorporatedInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Patent number: 7375594Abstract: Tuning a radio oscillator frequency to a reference frequency is disclosed. A radio oscillator is set using a predetermined value loaded into an adjustment bit array. A highest selected bit is selected to be used in locating a final tuned value for the adjustment bit array. The final tuned value is determined by successively setting a selected bit starting with the highest selected bit in the adjustment bit array. And, the selected bit value in the final tuned value is determined using a measurement of the radio oscillator frequency and its relation to a reference frequency.Type: GrantFiled: July 11, 2006Date of Patent: May 20, 2008Assignee: Dust Networks, Inc.Inventors: Mark Lemkin, Ben Cook
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Publication number: 20070166000Abstract: Disclosed are systems and methods for creating a trick mode stream. A digital home communication terminal (DHCT) comprises a network interface, a storage medium, at least one memory storing program code; and at least one processor programmed by at least the program code. The network interface is in communication with a second DHCT. The program code enables the DHCT to: select a first encoded picture frame from a recorded video stream on the storage medium; retrieve a first sequence of transport packets encapsulating the first picture frame; create a first transport packet containing a first client control packet associated with the first picture frame; and transmit, to a video decoder in the second DHCT, a trick mode stream comprising the first transport packet followed by the first sequence of transport packets. The first client control packet comprises the size of the first picture frame and a decoder command.Type: ApplicationFiled: March 1, 2005Publication date: July 19, 2007Inventors: Ramesh Nallur, Jianxin Ren, Hank Guo, Peter Chan, Ben Cook