Patents by Inventor Ben Cook

Ben Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240350883
    Abstract: A game board including a top panel and a plank and a game that comprises one or more of the game boards. A plank extends from the back end of the game board. The top surface of the game board is flat and includes a surrounding area and one or more target areas. A projectile comprising a weighted ball is thrown by players onto the top panel or plank surface. A method for playing the game involves two to four players who will throw or roll the balls to land on the desired location of the top panel or plank area to score points toward winning the game. The game includes multiple rounds.
    Type: Application
    Filed: April 19, 2024
    Publication date: October 24, 2024
    Applicant: Double G Games LLC
    Inventors: Gary Graham, Hudson Graham, James Faucher, Luke Lundquist, Dan Cook, Ben Allen, Isaac Allen
  • Patent number: 11958627
    Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: April 16, 2024
    Assignee: MBDA UK LIMITED
    Inventors: Edwin John William Bowden-Peters, Ben Cook
  • Patent number: 11417725
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: August 16, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Publication number: 20220135226
    Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).
    Type: Application
    Filed: February 14, 2020
    Publication date: May 5, 2022
    Inventors: Edwin John William BOWDEN-PETERS, Ben COOK
  • Patent number: 11059425
    Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 13, 2021
    Assignee: JAGUAR LAND ROVER LIMITED
    Inventors: Edward Simmons, Christopher Bellamy, Kripa Balachandran, James Pickup, Daniel Tait, Ben Cook, Emily Greenhalgh, Paul Kellitt, Christopher Brown, Matthew Atkinson, Thomas Booker, Lucy Wakefield, David Warburton
  • Publication number: 20210083047
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 18, 2021
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Patent number: 10854712
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: December 1, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Publication number: 20190176711
    Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 13, 2019
    Inventors: Edward SIMMONS, Christopher BELLAMY, Kripa BALACHANDRAN, James PICKUP, Daniel TAIT, Ben COOK, Emily GREENHALGH, Paul KELLITT, Christopher BROWN, Matthew ATKINSON, Thomas BOOKER, Lucy WAKEFIELD, David WARBURTON
  • Publication number: 20190172907
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 6, 2019
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Patent number: 10199461
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: February 5, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Publication number: 20180326914
    Abstract: Embodiments of the present invention provide a support structure for a vehicle seat comprising an integrated storage cavity, which may be used to store personal items such as an umbrella. The support structure comprises a reinforcement structure and a moulding, the reinforcement structure being located at least partially within the moulding.
    Type: Application
    Filed: May 10, 2018
    Publication date: November 15, 2018
    Inventors: Lauren COYLE, Mike HORSBURGH, Stefano LONGOBARDI, Richard HARRY, Andrew ROBINSON, Christopher BROWN, Ben COOK, Plamen PETROV
  • Publication number: 20170117356
    Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
    Type: Application
    Filed: October 27, 2015
    Publication date: April 27, 2017
    Applicant: Texas Instruments Incorporated
    Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
  • Patent number: 7375594
    Abstract: Tuning a radio oscillator frequency to a reference frequency is disclosed. A radio oscillator is set using a predetermined value loaded into an adjustment bit array. A highest selected bit is selected to be used in locating a final tuned value for the adjustment bit array. The final tuned value is determined by successively setting a selected bit starting with the highest selected bit in the adjustment bit array. And, the selected bit value in the final tuned value is determined using a measurement of the radio oscillator frequency and its relation to a reference frequency.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: May 20, 2008
    Assignee: Dust Networks, Inc.
    Inventors: Mark Lemkin, Ben Cook
  • Publication number: 20070166000
    Abstract: Disclosed are systems and methods for creating a trick mode stream. A digital home communication terminal (DHCT) comprises a network interface, a storage medium, at least one memory storing program code; and at least one processor programmed by at least the program code. The network interface is in communication with a second DHCT. The program code enables the DHCT to: select a first encoded picture frame from a recorded video stream on the storage medium; retrieve a first sequence of transport packets encapsulating the first picture frame; create a first transport packet containing a first client control packet associated with the first picture frame; and transmit, to a video decoder in the second DHCT, a trick mode stream comprising the first transport packet followed by the first sequence of transport packets. The first client control packet comprises the size of the first picture frame and a decoder command.
    Type: Application
    Filed: March 1, 2005
    Publication date: July 19, 2007
    Inventors: Ramesh Nallur, Jianxin Ren, Hank Guo, Peter Chan, Ben Cook