Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: The invention relates to a method of determining the relative positions of components of a munitions system, the munitions system comprising a first component (331) and at least one second component (333). The method comprises monitoring the output of a resonant circuit (305) provided on a first component (331), the resonant circuit (305) having a resonant frequency, detecting a change in the output due to a change in the resonant frequency caused by a change in the relative positions of the first component (331) and the at least one second component (333), and using the detected change to determine that the at least one second component (333) has moved relative to the first component (331).

Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: The present disclosure relates to a floor assembly for a vehicle load space. The floor assembly includes a floor panel that is configurable in a lowered position, a first raised position and a second raised position. The floor assembly includes a first pivot means defining a first pivot axis about which the floor panel pivots from the lowered position to the first raised position. The floor assembly includes a second pivot means defining a second pivot axis about which the floor panel pivots from the lowered position to said second raised position. The floor panel can perform different functions in the first and second raised positions. The present disclosure also relates to a vehicle having a floor assembly. The floor assembly may be provided in the floor of the vehicle load space.

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: Embodiments of the present invention provide a support structure for a vehicle seat comprising an integrated storage cavity, which may be used to store personal items such as an umbrella. The support structure comprises a reinforcement structure and a moulding, the reinforcement structure being located at least partially within the moulding.

Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.

Abstract: Tuning a radio oscillator frequency to a reference frequency is disclosed. A radio oscillator is set using a predetermined value loaded into an adjustment bit array. A highest selected bit is selected to be used in locating a final tuned value for the adjustment bit array. The final tuned value is determined by successively setting a selected bit starting with the highest selected bit in the adjustment bit array. And, the selected bit value in the final tuned value is determined using a measurement of the radio oscillator frequency and its relation to a reference frequency.

Abstract: Disclosed are systems and methods for creating a trick mode stream. A digital home communication terminal (DHCT) comprises a network interface, a storage medium, at least one memory storing program code; and at least one processor programmed by at least the program code. The network interface is in communication with a second DHCT. The program code enables the DHCT to: select a first encoded picture frame from a recorded video stream on the storage medium; retrieve a first sequence of transport packets encapsulating the first picture frame; create a first transport packet containing a first client control packet associated with the first picture frame; and transmit, to a video decoder in the second DHCT, a trick mode stream comprising the first transport packet followed by the first sequence of transport packets. The first client control packet comprises the size of the first picture frame and a decoder command.