Patents by Inventor Ben-Fan Xia
Ben-Fan Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9155222Abstract: An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air.Type: GrantFiled: August 7, 2013Date of Patent: October 6, 2015Assignee: ShenZhen Treasure City Technology Co., LTD.Inventors: Zhen-Yu Wang, Chang-Shen Chang, Ben-Fan Xia
-
Patent number: 9111903Abstract: A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion defines a hole, an upper groove and a lower groove communicating with one another. The upper groove and the lower groove are coaxial with each other. A flange protrudes from a circumference of the pole portion. The pole portion enters the upper groove. The flange abuts a bottom of the conductive plate and is received in the lower groove. The elastic element elastically abuts the top of the conductive plate.Type: GrantFiled: August 2, 2012Date of Patent: August 18, 2015Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventor: Ben-Fan Xia
-
Patent number: 9111910Abstract: A heat dissipation device includes a heat pipe and a fin set. The fin set includes a plurality of fins. Each of the fins includes a body, a first flange vertically extending from a top side of the body, and a second flange vertically extending from a bottom side of the body. The first flange has a first edge abutting a front neighboring fin and a second edge spaced to the first edge to define a slit. The first flange forms an extending portion extending from the second edge to define a gap between the extending portion and the body of the front neighboring fin. Each of the extending portions is soldered to the body of the front neighboring fin by solder filled in the gap between the extending portion and the body of the front neighboring fin from the slit.Type: GrantFiled: April 9, 2012Date of Patent: August 18, 2015Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventor: Ben-Fan Xia
-
Patent number: 8811010Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.Type: GrantFiled: June 7, 2012Date of Patent: August 19, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Zhen-Yu Wang, Chang-Shen Chang, Ben-Fan Xia
-
Publication number: 20140182818Abstract: A heat sink for dissipating heat generated by an electronic element is provided. The heat sink includes a heat pipe and a conducting member for transferring heat generated by the electronic element to the heat pipe. The conducting member abuts the electronic element, and the conducting member is applied onto the heat pipe to reduce a thickness of the heat sink.Type: ApplicationFiled: August 7, 2013Publication date: July 3, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: ZHEN-YU WANG, CHANG-SHEN CHANG, BEN-FAN XIA
-
Publication number: 20140071641Abstract: A power supply device includes a laptop battery and a voltage converter secured to the laptop battery. The laptop battery includes a first connecting portion and a first interface for outputting a first voltage. The voltage converter includes a housing, a second connecting portion formed in the housing and a circuit board secured to the housing. The circuit board includes a second interface, a first converting unit and a third interface. The first connecting portion is detachably coupled to the second portion to secure the voltage converter to the laptop battery. The second interface is electronically connected to the first interface so as to receive the first voltage when the first connecting portion is coupled to the second connecting portion. The first converting unit converts the first voltage to the second voltage and outputs the second voltage through the third interface.Type: ApplicationFiled: September 3, 2013Publication date: March 13, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) Co., LTD.Inventors: ZHEN-YU WANG, CHANG-SHEN CHANG, BEN-FAN XIA
-
Publication number: 20140063733Abstract: An electronic device includes a mainboard and a fan mounted on the mainboard. The fan includes a stator and a rotor. The rotor includes a hub covering around a periphery of the stator, and a plurality of blades disposed at a periphery of the hub. The stator is directly fixed to and directly electrically connected to the mainboard.Type: ApplicationFiled: October 25, 2012Publication date: March 6, 2014Inventors: BEN-FAN XIA, ZHEN-YU WANG
-
Publication number: 20140049915Abstract: An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air.Type: ApplicationFiled: August 7, 2013Publication date: February 20, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: ZHEN-YU WANG, CHANG-SHEN CHANG, BEN-FAN XIA
-
Publication number: 20140000855Abstract: A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion defines a hole, an upper groove and a lower groove communicating with one another. The upper groove and the lower groove are coaxial with each other. A flange protrudes from a circumference of the pole portion. The pole portion enters the upper groove. The flange abuts a bottom of the conductive plate and is received in the lower groove. The elastic element elastically abuts the top of the conductive plate.Type: ApplicationFiled: August 2, 2012Publication date: January 2, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventor: BEN-FAN XIA
-
Publication number: 20130306294Abstract: A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion includes a hole and a groove communicating with the hole. A flange protrudes from a circumference of the pole portion. The pole portion enters the groove. The flange abuts a bottom of the conductive plate. The elastic element elastically abuts the top of the conductive plate.Type: ApplicationFiled: August 2, 2012Publication date: November 21, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventor: BEN-FAN XIA
-
Publication number: 20130286588Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.Type: ApplicationFiled: June 7, 2012Publication date: October 31, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: ZHEN-YU WANG, CHANG-SHEN CHANG, BEN-FAN XIA
-
Patent number: 8553415Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.Type: GrantFiled: December 23, 2011Date of Patent: October 8, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Zhen-Yu Wang, Chang-Shen Chang, Ben-Fan Xia
-
Publication number: 20130105121Abstract: A heat dissipation device includes a heat pipe and a fin set. The fin set includes a plurality of fins. Each of the fins includes a body, a first flange vertically extending from a top side of the body, and a second flange vertically extending from a bottom side of the body. The first flange has a first edge abutting a front neighboring fin and a second edge spaced to the first edge to define a slit. The first flange forms an extending portion extending from the second edge to define a gap between the extending portion and the body of the front neighboring fin. Each of the extending portions is soldered to the body of the front neighboring fin by solder filled in the gap between the extending portion and the body of the front neighboring fin from the slit.Type: ApplicationFiled: April 9, 2012Publication date: May 2, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventor: BEN-FAN XIA
-
Publication number: 20130056182Abstract: A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged at a central portion of the air outlet, and two second fin sets respectively arranged at a side portion of the air outlet. The first fin set includes a plurality of first fins with a first passage defined between each two neighboring first fins. Each of the second fin sets includes a plurality of second fins with a second passage defined between each two neighboring second fins. Each of the second fin sets defines an undercut near the air outlet of the fan. The first passages communicate with the central portion of the air outlet of the fan. Each of the undercuts of the second fin sets communicates with corresponding side portion and corresponding second passage.Type: ApplicationFiled: April 26, 2012Publication date: March 7, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: Ben-Fan XIA, Ching-Bai HWANG, Zhen-Yu WANG
-
Publication number: 20130050941Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.Type: ApplicationFiled: December 23, 2011Publication date: February 28, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO., LTD.Inventors: ZHEN-YU WANG, CHANG-SHEN CHANG, BEN-FAN XIA
-
Publication number: 20130048256Abstract: A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged on a side portion of the air outlet, a second fin set arranged on a central portion of the air outlet and a third fin set. The first fin set includes a plurality of first fins with a first passage is defined between each two neighboring first fins. The second fin set includes a plurality of second fins with a second passage defined between each two neighboring second fins, a width of the second passage is less than that of the first passage. The third fin set includes a plurality of third fins. Each third fin is arranged between two neighboring first fins and divides an outer portion of the first passage away from the outlet of the fan into two third passages.Type: ApplicationFiled: December 23, 2011Publication date: February 28, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: ZHEN-YU WANG, BEN-FAN XIA
-
Publication number: 20130048255Abstract: A heat dissipation device includes a housing, a fan mounted within the housing, a fin assembly fixed to the housing and heat pipes attached on the fin assembly. The housing includes a panel and a sidewall extending upwardly from a periphery of the panel. The fin assembly includes first fins and second fins alternately arranged on the panel. The first fins and the second fins each include a plate, an upper flange and a lower flange extending from a top side and a bottom side of the plate, respectively. Each second fin defines a slot in a lateral side of the plate thereof adjacent to the fan. Every two adjacent first fin and second fin define a channel therebetween. Two adjacent channels communicate with each other at inlets thereof via the slot, and separated from each other at outlets thereof via a second fin.Type: ApplicationFiled: August 30, 2011Publication date: February 28, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: BEN-FAN XIA, ZHEN-YU WANG
-
Publication number: 20130033878Abstract: A heat dissipation module includes a plurality of fins. Each fin includes a main body, a bottom bending plate bending from a bottom edge of the main body, a top bending plate bending from a top edge of the main body, and a slick flange folding inwards from an outer edge of the main body. The flange overlaps the main body at the outer edge of a corresponding fin. The present disclosure also relates to an LED illumination device using the heat dissipation module.Type: ApplicationFiled: August 24, 2011Publication date: February 7, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: BEN-FAN XIA, CHING-BAI HWANG, JUI-WEN HUNG
-
Publication number: 20120325431Abstract: A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat sink attached to the electronic component, a fan, and a fan holder. The fan includes a frame and a rotor received in the frame. The fan holder mounts the fan onto the heat sink and includes a base fixed on the heat sink, four clasps extending upward from four corners of a top surface of the base, and four elastic portions corresponding to the clasps and configured to resiliently urge the frame of the fan. The frame of the fan is arranged on the base of the fan holder and sandwiched between the clasps and the elastic portions.Type: ApplicationFiled: August 23, 2011Publication date: December 27, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventor: BEN-FAN XIA
-
Publication number: 20120318482Abstract: An exemplary heat dissipation device includes a heat pipe and a fin assembly. The heat pipe includes a main body and an end portion. The end portion has a width smaller than that of the main body. The fin assembly includes a first fin and a second fin adjoining to the first fin. The first fin forms a flange from a side of thereof. The second fin forms a flange from a side of thereof. The flange of the first fin has an extending portion overlapping and soldering to the flange of the second fin. The extending portion defines a number of through holes corresponding to the flange of the second fin. The end portion of the heat pipe is soldered to the extending portion of the first fin and soldered to the flange of the second fin by the through holes of the extending portion.Type: ApplicationFiled: August 30, 2011Publication date: December 20, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventor: BEN-FAN XIA