Abstract: A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.

Abstract: An LED device has a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer on the N-type semiconductor layer, a P-type semiconductor layer on the light-emitting layer and a transparent electrode layer formed on the P-type semiconductor layer. A top surface of the transparent electrode layer is formed to have multiple micro concave-convex structures to mitigate the light-emitting loss resulted from total reflection, and increase the light-emitting efficiency of the LED device.

Abstract: A motor of a door lock for a vehicle comprises: a motor housing; an end cap fixed to the motor housing; and a rotation detector. The motor housing accommodates an armature including a motor shaft and a commutator. A sensor magnet is fixed to the motor shaft and the rotation detector comprises a rotation sensor fixed to a circuit board fixed to an inner part of the end cap and disposed adjacent the sensor magnet for sensing rotation of the magnet to produce a corresponding signal. A sensor connector fixed to the circuit board and electrically connected with the rotation sensor; connects to signal wires which transfer the signal to a microprocessor of the vehicle.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: An improved color changeable tube light includes a opaque core line, a plurality of LEDs being arranged in the core line, a translucent diffuser with the same length as the core line, a cladding layer having the same length as the core line and covering the core line and being formed by extrusion molding integrally with the diffuser into one piece. A unit is formed by disposing a red LED, a green LED and a blue LED of the plurality of LEDs into a fixing means, a plurality of the units are connected in series and disposed in the plurality of transversal through-holes of the core line respectively. The fixing means may be a box. The box may be quadrate, round or elliptic in shape. The tube light of the present invention to have the effects of light beams of neon light, and the color changing and the color mixing to obtain various results are available.

Abstract: A method for generating low color temperature light and a light emitting device adopting the same, comprise a LED component, phosphor capable to be excited by the emission light of the LED component, and a package colloid for encapsulating the LED component and the phosphor, wherein the package colloid is provided with a electrode lead for connecting the LED component with the external power supply, the peak wavelength of emission light of the LED light is 460-500 nm, the peak wavelength of emission light of the excited phosphor is 580-630 nm. The present invention only use one chip and one kind of phosphor to generate the low color temperature light which is of the same effect as that of the minitype tungsten lamp or the high pressure sodium lamp, and is of advantages including energy saving, low cost and environmental protection, etc. The present invention can be widely used in the manufacturing process of LED lamp of low color temperature, especially in the manufacturing the mini LED bulb.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: A PMDC motor, particularly for driving an automobile liftgate, comprises a stator and a rotor rotatably mounted to the stator. The stator comprises a housing and an end cap mounted to one end of the housing. The end cap comprises: a first brush, a second brush, a first terminal, a second terminal, a first choke connected in series with the first brush and the first terminal, a second choke connected in series with the second brush and the second terminal, an overcurrent protection component connected in series with the second brush, and a set of capacitors. Each of the chokes comprises an inductor core extending axially and a winding wound about the inductor core.

Abstract: A motor comprises a stator and a rotor (20) disposed within the stator. The stator comprises: a housing (31) having a polygon cross section that comprises a plurality of side portions (32a-32d) and a plurality of curved corner portions (33a-33d), each of the corner portions connect two adjacent side portions and curve around a center (O?) which is offset from the rotational center (O) of the rotor; and a ring magnet (34) fixed to the inner surface of the housing. An air gap (37) is formed between a peripheral surface of the rotor (35) and an inner surface of the ring magnet (34). The thickness of the ring magnet at portions corresponding to the corner portions (33a-33d) of the housing being larger than the thickness of the ring magnet at portions corresponding to the side portions (32a-32d) of the housing.

Abstract: An electric motor has a rotor (20), a housing (10) and a ring magnet (12) fixed onto an inner surface of the housing. The housing (10) has a cross section in a polygon, preferably tetragonal, shape that comprises a plurality of side portions (10a˜10d) and a plurality of curved corner portions (11a˜11d), each of which connects two adjacent side portions. The thickness of the ring magnet at portions corresponding to the corner portions of the housing is larger than the thickness of the ring magnet at portions corresponding to the side portions of the housing. An air gap (123) is formed between a peripheral surface of the rotor and an inner surface of the ring magnet, the thickness of the air gap at portions corresponding to the corner portions of the housing being smaller than that of the air gap at portions corresponding to the side portions of the housing. The motor has a polygon housing which is convenient to install and has good space utilization.

Abstract: A motor comprises a stator and a rotor (20) disposed within the stator. The stator comprises a shell comprising a plurality of sidewalls (10a-10d) and arcuate connection parts (11a-11d) connecting neighboring sidewalls. The cross section of the shell is a polygon with fillets. The stator also comprises a plurality of magnets (12a-12d) installed inside the arcuate connection parts. The magnets (12a-12d) are mutual arranged at intervals. The outer surface of each magnet (12a-12d) is attached to inner surfaces of the two neighboring sidewalls (10a-10b) and a gap is formed between the magnet and the inner surface of the corresponding arcuate connection part. Air gaps are formed between the inner surface of the magnets (12a-12d) and the outer surface of the rotor. Disposing the magnets inside the arcuate connection parts improves the space utilization ratio.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

Abstract: A power limiting circuit for controlling the power of the incandescent lamp not to overrun the rated power limit includes a sampling circuit that consists of two resistors connected in parallel. A control chip compares the received sample voltage with the standard voltage then outputs control signal to drive the conduction of a SCR (silicon controlled rectifier) to change the inner states of contacts of a relay so as to further control the on/off between the input and the output. Based on this control process and technique, this invention prevents the employment of incandescent lamps having a greater power than power rating. Besides, a bi-operational amplifier circuit is used to fulfill the whole examination and control perfectly.

Abstract: A noise suppression circuit uses a chip type ferrite bead as a major component of the noise suppression circuit. A motor using this circuit and the compact arrangement of the noise suppression circuit within the layout of an end cap of the motor is also disclosed. The preferred embodiment avoids soldering of the ferrite bead during assembly of the motor.

Abstract: A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.

Abstract: An LED device has a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer on the N-type semiconductor layer, a P-type semiconductor layer on the light-emitting layer and a transparent electrode layer formed on the P-type semiconductor layer. A top surface of the transparent electrode layer is formed to have multiple micro concave-convex structures to mitigate the light-emitting loss resulted from total reflection, and increase the light-emitting efficiency of the LED device.

Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.